Provided is a method of producing a target material with reduced particle generation during sputtering, which is a method of producing a sputtering target material whose material is an alloy M, including a sintering step of sintering a mixed powder obtained by mixing a first powder and a second powder. A material of the first powder is an alloy M1 in which the proportion of a B content is from 40 at. % to 60 at. %. A material of the second powder is an alloy M2 in which the proportion of a B content is from 20 at. % to 35 at. %. The proportion of a B content in the mixed powder is from 33 at. % to 50 at. %. A metallographic structure including a (CoFe).sub.2B phase and a (CoFe)B phase is formed in the sintering step. A boundary length per unit area Y (1/μm), which is obtained by measuring a boundary length between the (CoFe).sub.2B phase and the (CoFe)B phase using a scanning electron microscope, and a proportion X (at. %) of a B content of the alloy M satisfy the expression

Y<−0.0015×(X−42.5).sup.2+0.15.

Provided is a method of producing a target material with reduced particle generation during sputtering, which is a method of producing a sputtering target material whose material is an alloy M, including a sintering step of sintering a mixed powder obtained by mixing a first powder and a second powder. A material of the first powder is an alloy M1 in which the proportion of a B content is from 40 at. % to 60 at. %. A material of the second powder is an alloy M2 in which the proportion of a B content is from 20 at. % to 35 at. %. The proportion of a B content in the mixed powder is from 33 at. % to 50 at. %. A metallographic structure including a (CoFe).sub.2B phase and a (CoFe)B phase is formed in the sintering step. A boundary length per unit area Y (1/μm), which is obtained by measuring a boundary length between the (CoFe).sub.2B phase and the (CoFe)B phase using a scanning electron microscope, and a proportion X (at. %) of a B content of the alloy M satisfy the expression

Y<−0.0015×(X−42.5).sup.2+0.15.

A method for fabricating an external element or a timepiece dial from non-conductive material, by performing or repeating a basic cycle of making a base from a non-conductive, or ceramic, or glass. or sapphire substrate; dry coating the base with a first sacrificial protective metal layer; etching a decoration with an ultrashort pulse laser to a depth at least equal to the local thickness of the first layer; dry coating the decoration and the remaining part of the first layer with a second metal and/or coloured decorative treatment layer; chemically removing each first layer; and before or after chemical removal of each first layer, mechanically levelling on the upper level of the base the compound thus formed.

A method for fabricating an external element or a timepiece dial from non-conductive material, by performing or repeating a basic cycle of making a base from a non-conductive, or ceramic, or glass. or sapphire substrate; dry coating the base with a first sacrificial protective metal layer; etching a decoration with an ultrashort pulse laser to a depth at least equal to the local thickness of the first layer; dry coating the decoration and the remaining part of the first layer with a second metal and/or coloured decorative treatment layer; chemically removing each first layer; and before or after chemical removal of each first layer, mechanically levelling on the upper level of the base the compound thus formed.

A metallic lustrous member with radio wave transmissibility is provided, which is capable of being easily produced, while ensuring a structure in which not only chromium or indium but also any of some other metals such as aluminum is formed as a metal layer on a continuous surface of any of various materials, and also an article using the member is provided. A production method for a metallic lustrous member with radio wave transmissibility, which is capable of easily forming, as a metal layer, not only chromium or indium but also any of some other metals such as aluminum, on a continuous surface of any of various materials. The metallic lustrous member comprises a substrate having radio wave transmissibility, and an aluminum layer formed directly on a continuous surface of the substrate. The aluminum layer has a discontinuous region including a plurality of separated segments which are mutually discontinuous.

A metallic lustrous member with radio wave transmissibility is provided, which is capable of being easily produced, while ensuring a structure in which not only chromium or indium but also any of some other metals such as aluminum is formed as a metal layer on a continuous surface of any of various materials, and also an article using the member is provided. A production method for a metallic lustrous member with radio wave transmissibility, which is capable of easily forming, as a metal layer, not only chromium or indium but also any of some other metals such as aluminum, on a continuous surface of any of various materials. The metallic lustrous member comprises a substrate having radio wave transmissibility, and an aluminum layer formed directly on a continuous surface of the substrate. The aluminum layer has a discontinuous region including a plurality of separated segments which are mutually discontinuous.

Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.

Systems, methods, and devices of the various embodiments provide for microfabrication of devices, such as semiconductors, thermoelectric devices, etc. Various embodiments may include a method for fabricating a device, such as a semiconductor (e.g., a silicon (Si)-based complementary metal-oxide-semiconductor (CMOS), etc.), thermoelectric device, etc., using a mask. In some embodiments, the mask may be configured to allow molecules in a deposition plume to pass through one or more holes in the mask. In some embodiments, molecules in a deposition plume may pass around the mask. Various embodiments may provide thermoelectric devices having metallic junctions. Various embodiments may provide thermoelectric devices having metallic junctions rather than junctions formed from semiconductors.

A chamber for a physical vapor deposition (PVD) apparatus includes a collimator configured to narrow filter sputtered particles into a beam, an electrostatic chuck configured to support a substrate in the chamber, a shield and a chamber plate. The chamber plate includes a nut plate portion having a plurality of nut plates and a plurality of cavities in the chamber plate that are configured to allow gas to ingress and egress, wherein the cavities and nut plates are provided in equal numbers. The chamber is configured to operate at a target pressure, and the number of nut plates and corresponding number of cavities are determined based on the target pressure.

A chamber for a physical vapor deposition (PVD) apparatus includes a collimator configured to narrow filter sputtered particles into a beam, an electrostatic chuck configured to support a substrate in the chamber, a shield and a chamber plate. The chamber plate includes a nut plate portion having a plurality of nut plates and a plurality of cavities in the chamber plate that are configured to allow gas to ingress and egress, wherein the cavities and nut plates are provided in equal numbers. The chamber is configured to operate at a target pressure, and the number of nut plates and corresponding number of cavities are determined based on the target pressure.