Patent classifications
C23C14/26
EVAPORATOR FOR EFFECTIVE SURFACE AREA EVAPORATION
A method and apparatus for thermal evaporation are provided. The thermal evaporator includes a flat crucible design, which provides an increased surface area for evaporation of the material to be deposited relative to conventional designs. The increased surface area for evaporation means that the more vapor of the evaporated material can be produced, which increases pressure inside the evaporator body leading to increased flow of the evaporated material out of the nozzles. The flat crucible can be attached to an evaporator body of the thermal evaporator. The flat crucible can be integrated within the evaporator body. The evaporator body can include a plurality of longitudinal grooves, which increase the surface area of the evaporator body. The thermal evaporator can include a plurality of baffles which divide the thermal evaporator into separate compartments.
CLOSE COUPLE DIFFUSER FOR PHYSICAL VAPOR DEPOSITION WEB COATING
An evaporation system for providing a gas for a reactive deposition process, reactive deposition apparatuses, and methods of reactive deposition are provided. The evaporation system in includes a multi-zone diffuser assembly for single or double-sided continuous roll-to-roll or batch coating of web substrates. The diffuser assembly is sized to accommodate at least a portion of a coating drum. The diffuser assembly includes a plurality of interchangeable solid plates and diffuser plates for delivering an evaporated material toward a web substrate. The diffuser plates are fluidly coupled with an evaporation source.
VAPOR DEPOSITION APPARATUS AND METHOD
A vapor deposition apparatus includes a chamber configured to operate at vacuum and at least one crucible in the chamber. The crucible is configured to receive an ingot, a feeder operable to move the ingot with respect to the at least one crucible, and a heater in the chamber and configured to heat a hot zone between the at least one crucible and the feeder. A method for vapor deposition is also disclosed.
VAPOR DEPOSITION APPARATUS AND METHOD
A vapor deposition apparatus includes a chamber configured to operate at vacuum and at least one crucible in the chamber. The crucible is configured to receive an ingot, a feeder operable to move the ingot with respect to the at least one crucible, and a heater in the chamber and configured to heat a hot zone between the at least one crucible and the feeder. A method for vapor deposition is also disclosed.
Temperature control roller, transporting arrangement and vacuum arrangement
According to various embodiments, the temperature control roller may comprise: a cylindrical roller shell, which has a multiplicity of gas outlet openings; a temperature control device, which is configured to supply and/or extract thermal energy to or from the cylindrical roller shell; multiple gas lines made to extend along the axis of rotation; a gas distributing structure, which couples the multiple gas lines and the multiplicity of gas outlet openings to one another in a gas-conducting manner, the gas distributing structure having a lower structure density than the multiplicity of gas outlet openings.
Temperature control roller, transporting arrangement and vacuum arrangement
According to various embodiments, the temperature control roller may comprise: a cylindrical roller shell, which has a multiplicity of gas outlet openings; a temperature control device, which is configured to supply and/or extract thermal energy to or from the cylindrical roller shell; multiple gas lines made to extend along the axis of rotation; a gas distributing structure, which couples the multiple gas lines and the multiplicity of gas outlet openings to one another in a gas-conducting manner, the gas distributing structure having a lower structure density than the multiplicity of gas outlet openings.
Compound for release agent and method for preparing the same
The present invention relates to a compound for release agent and method for preparing the same, and more specifically, to a compound for a release agent that can be coated in an ultra-thin form without thermal deformation even when heat is continuously or discontinuously applied in a continuous evaporator, and a method for preparing the same.
Mid-infrared lens and manufacturing method thereof
The present invention relates to a manufacturing method for a mid-infrared lens, which includes the following steps: placing a lens in the path of a far-infrared radiation source, enabling the lens to receive the far infrared rays; immersing the lens in a hardening liquid, causing the hardening liquid to coat the lens, wherein the hardening liquid is an intermixture of silicone and isopropanol or an intermixture of silicone and methanol, and a far-infrared material or a far-infrared composite material is additionally added to the hardening liquid; placing the lens coated with the hardening liquid in a drying space to dry, causing the hardening liquid to dry and harden and form a hardened layer on the surface of the lens. The temperature of the drying space lies between 80 and 120° C., and the drying time lies between 1 and 10 hours.
FORMING METHOD OF PLASMA RESISTANT OXYFLUORIDE COATING LAYER
The present invention relates to a method of forming a plasma resistant oxyfluoride coating layer, including: mounting a substrate on a substrate holder provided in a chamber; causing an electron beam scanned from an electron gun to be incident on an oxide evaporation source accommodated in a first crucible, and heating, melting, and vaporizing the oxide evaporation source as the electron beam is incident on the oxide evaporation source; vaporizing a fluoride accommodated in a second crucible; and advancing an evaporation gas generated from the oxide evaporation source and a fluorine-containing gas generated from the fluoride toward the substrate, and reacting the evaporation gas generated from the oxide evaporation source and the fluorine-containing gas generated from the fluoride to deposit an oxyfluoride on the substrate. According to the present invention, it is possible to form a dense and stable oxyfluoride coating layer having excellent plasma resistance, suppressed generation of contaminant particles, and no cracks.
FORMING METHOD OF PLASMA RESISTANT OXYFLUORIDE COATING LAYER
The present invention relates to a method of forming a plasma resistant oxyfluoride coating layer, including: mounting a substrate on a substrate holder provided in a chamber; causing an electron beam scanned from an electron gun to be incident on an oxide evaporation source accommodated in a first crucible, and heating, melting, and vaporizing the oxide evaporation source as the electron beam is incident on the oxide evaporation source; vaporizing a fluoride accommodated in a second crucible; and advancing an evaporation gas generated from the oxide evaporation source and a fluorine-containing gas generated from the fluoride toward the substrate, and reacting the evaporation gas generated from the oxide evaporation source and the fluorine-containing gas generated from the fluoride to deposit an oxyfluoride on the substrate. According to the present invention, it is possible to form a dense and stable oxyfluoride coating layer having excellent plasma resistance, suppressed generation of contaminant particles, and no cracks.