C23C14/357

DEVICE AND METHOD FOR PRODUCING LAYERS WITH IMPROVED UNIFORMITY IN COATING SYSTEMS WITH HORIZONTALLY ROTATING SUBSTRATE AND ADDITIONAL PLASMA SOURCES

The invention relates to a device and a method for producing layers whose layer thickness distribution can be adjusted in coating systems with horizontally rotating substrate. A very homogeneous or a specific non-homogeneous distribution can be adjusted. The particle loading is also significantly reduced. The service life is significantly higher compared to other methods. Forming of parasitic coatings is reduced.

TUNING POROUS SURFACE COATINGS USING A PLASMA SPRAY TORCH
20230147825 · 2023-05-11 · ·

A system and method are provided to create porous surface coatings. In use, a method is included for receiving, at a plasma spray torch, inputs comprising metallic particles and carbon particles, using the plasma spray torch to cause in-situ nucleation of the inputs to synthesize carbon-containing composite materials, and flowing the synthesized carbon-containing composite materials onto a substrate. Some or all of the synthesized carbon-containing composite materials may include a surface layer and/or a bonding layer. Additionally, the method may include tuning the inputs based on tuning characteristics, the tuning characteristics including one or more of: porosity, heat transfer, or resistance to corrosion. Further, the method may include tuning the inputs to optimize temperature redistribution across a surface layer of some or all of the synthesized carbon-containing composite materials.

Coaxial microwave applicator for plasma production

The disclosure includes a coaxial microwave applicator for plasma production, including a coaxial tube formed by a central core and an outer conductor separated from the central core by an annular space allowing propagation of microwaves. The applicator includes: a cylindrical permanent magnet disposed at the end of the central core; and at least one annular permanent magnet disposed at the end of the outer conductor, all of the magnets disposed at the end of the coaxial tube having the same direction of magnetization. The magnetization of the magnets forms a magnetic field suitable for generating, in a zone away from the end of the applicator, an electronic cyclotronic resonance coupling with the electric microwave field of the applicator. The external radius and the magnetization of the annular magnet are selected such that the magnetic field lines generated by the magnets pass through the coupling zone in a direction substantially parallel to the axis of the applicator.

Method for improving service life of magnetron
20220136098 · 2022-05-05 ·

A method for improving service life of a magnetron, which belongs to the technical field of microwave applications, includes: taking anode working voltage range is taken as n voltage values U1 . . . Un constituting an arithmetic sequence; taking the voltage value as the anode voltage; in each voltage value, adjusting the magnet coil current between I min and Imax by the coil current control part , so that the output power P of the experimental magnetron is equal to the target power P0, and measuring the cathode filament temperature at this time by the temperature measuring part, which is denoted as Ti; measuring all the cathode filament temperatures Ti as the temperature data set corresponding to P0 by the temperature measuring part; taking out the minimum temperature value Tmin in the temperature data set, and using the anode voltage value and the magnet coil current value corresponding to Tmin as the working magnetron, wherein the output power is the anode voltage value and the magnet coil current value of P0. The present invention provides a method for improving the service life of a magnetron, which adjusts the electric field and the magnetic field, finds the synergy between the magnetic field and the electric field, and improves the service life of the magnetron.

Modular microwave source with local lorentz force

Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.

TARGET AND FILM FORMING APPARATUS
20230369034 · 2023-11-16 ·

A film forming apparatus 1 includes a target TA, a ring-shaped shield member 30 provided between the target TA and a plasma generation unit, and a ring-shaped shield member 40 provided between the target TA and a workpiece holding unit. The target TA includes a cylindrical target member 21 and a backing tube (supporting member) 20 configured to support the target member 21. Each of the shield member 30, the shield member 40, and the target member 21 is stacked in a Z direction around an axis VL1 as a central axis extending in the Z direction, each of the shield member 30, the target member 21, and the shield member 40 is arranged so as to be separated from each other in the Z direction, and an inner diameter D1 of the shield member 30 is smaller than an inner diameter D2 of the target member 21.

Carbon layer covered mask in 3D applications

Embodiments of the present disclosure generally relate to a method for forming an opening using a mask. In one embodiment, a method includes forming a mask on a feature layer. The method includes forming a first opening in the mask to expose a portion of the feature layer. The method further includes forming a carbon layer on the mask and the exposed portion of the feature layer. The method also includes removing portions of the carbon layer and a portion of the exposed portion of the feature layer in order to form a second opening in the feature layer.

SPUTTERING DEVICE
20220267893 · 2022-08-25 ·

A sputtering device includes a reaction chamber, a thimble mechanism, and a microwave heating mechanism. The reaction chamber includes a base configured to carry a workpiece. The thimble mechanism is arranged in the reaction chamber. The thimble mechanism generates a relative ascending and descending motion with the base and lifts the workpiece from the base. The microwave heating mechanism is arranged in the reaction chamber and includes a microwave transmitter and a mobile device. The mobile device is connected to the microwave transmitter and configured to move the microwave transmitter to a position under the workpiece in response to the workpiece being carried by the thimble mechanism to cause the microwave transmitter to emit microwaves to the workpiece to heat the workpiece.

Method for vapor depositing a substrate

The present disclosure relates to the field of vapor deposition technologies, and discloses a vapor deposition method. The vapor deposition method includes: applying an exciting acoustic wave to the target, such that particles in a predetermined location of the target break away from the target and adhere to a predetermined region of the substrate when an energy of the particles is higher than an energy required for the particles to break away from the target. By using the vapor deposition method, losses of vapor deposition materials may be avoided, utilization of the vapor deposition materials may be increased, and thus costs may be reduced.

TARGET, FILM FORMING APPARATUS, AND METHOD OF MANUFACTURING FILM FORMATION OBJECT
20220102124 · 2022-03-31 ·

An object is to extend the life of the target member. The target (TA2) is designed to have a symmetrical structure so as to realize an invertible configuration. According to this, even if the consumption of the target member (71) is large on the side closer to the plasma generation unit where the plasma density is high, the portion of the target member (71) which has been located on the side closer to the film formation object where the plasma density is low and is thus consumed less can be rearranged on the side closer to the plasma generation unit where the plasma density is high, by inverting the target (TA2).