Patent classifications
C23C18/1225
LAYERED POLYCRYSTALLINE LEAD SELENIDE PHOTOELECTRIC FILM AND FABRICATION METHOD THEREOF
The present invention relates to a photoelectric film and a fabrication method thereof, and in particular, to a layered polycrystalline lead selenide (PbSe) film and a fabrication method thereof. The fabrication method mainly includes: (1) fabricating a dense PbSe layer on a substrate through chemical bath deposition (CBD); (2) fabricating a loose plumbonacrite (Pb.sub.10O(OH).sub.6(CO.sub.3).sub.6) layer on the dense PbSe layer through CBD; (3) placing a sample with the dense PbSe layer and the Pb.sub.10O(OH).sub.6(CO.sub.3).sub.6 layer in a selenium ion-containing solution to allow an ion exchange reaction to finally form the layered polycrystalline PbSe film. The fabrication method has the advantages of simple process, low cost, and high controllability. The PbSe film fabricated by the method is composed of a lower dense polycrystalline cubic PbSe layer and an upper loose polycrystalline cubic PbSe layer, which can be widely used in the fabrication of components in the field of photoelectric conversion or thermoelectric conversion, such as infrared (IR) sensors, solar cells, laser emitters, and thermoelectric converters.
BAKING TRAY OR BAKING GRID HAVING A NON-STICK AND/OR NON-WETTING COATING, COOKING APPLIANCE COMPRISING SUCH A BAKING TRAY OR BAKING GRID AND METHOD FOR MANUFACTURING A BAKING TRAY OR BAKING GRID
The present invention relates to a baking tray (20) or baking grid, in particular a baking tray (20) for a cooking appliance (1), having a non-stick and/or non-wetting coating (12) obtainable by a process characterised by the following steps, a) providing a baking tray (20) or baking grid having a surface, in particular having an upper surface (7a) and a bottom surface (7b), b) preferably, pretreating of the surface (7a, 7b) of the baking tray (20) or baking grid at least partially, in particular completely, for providing a surface having a roughness being suitable for applying a non-stick and/or non-wetting coating (12) by mechanical treatment, physical treatment or chemical treatment, in particular by sandblasting and/or laser treatment and/or a surface activation treatment, particularly a plasma treatment, and/or an enamelling process to form a ground layer (13), c) applying the non-stick and/or non-wetting coating (12) to the pretreated surface (7a, 7b) of the baking tray (20) or baking grid or a surface (14a) of the ground layer (13), wherein the non-stick and/or non-wetting coating (12) comprises at least one layer (17) that is obtained by a sol-gel process from a first composition comprising a silica sol and a silane. The invention further relates to a cooking appliance (1), in particular a domestic oven comprising such a baking tray (20) or baking grid and a method for manufacturing such a baking tray (20) or baking grid.
Sol-gel coated oven and coating process
A methods and systems are disclosed for coating a large oven cavity. A method of coating an oven includes spraying a coating at room temperature onto a plurality of surfaces in the oven cavity in one or more layers and manipulating the oven to position the plurality of surfaces while spraying in various embodiments. An article includes an oven having a cavity, where the cavity has a surface with a volume of about 3 ft.sup.3 to about 7 ft.sup.3, and a coating on the surface of the cavity, the coating including a sol-gel ceramic.
Electrode for Electrolysis
The present technology relates to an electrode for electrolysis which has a coating layer containing an ytterbium oxide, wherein the electrode for electrolysis of the present technology is characterized by exhibiting excellent durability and improved overvoltage. Further, the present technology relates to a method of preparing an electrode for electrolysis which includes: applying a coating composition on at least one surface of a metal base, and coating by drying and heat-treating the metal base on which the coating composition has been applied, wherein the coating composition includes a ruthenium precursor and an ytterbium precursor.
Turbine engine part coated in a thermal barrier, and a method of obtaining it
A turbine engine part coated in at least a first ceramic layer forming a thermal barrier and including a ceramic material with first ceramic fibers dispersed in the first layer. The first layer may have a chemical composition gradient between a material for forming a thermal barrier and a material for providing protection against calcium and magnesium aluminosilicates, which is present at a greater content in an outer zone of the first layer, and/or the first layer may be porous and may present a porosity gradient such that an outer portion of the first layer presents lower porosity.
PRECURSOR SOLUTION FOR COPPER-ZINC-TIN-SULFUR THIN FILM SOLAR CELL, PREPARATION METHOD THEREFOR, AND USE THEREOF
Disclosed are a precursor solution for a copper-zinc-tin-sulfur (CZTS) thin film solar cell, a preparation method therefor, and the use thereof. The present invention discloses two types of simple metal complexes which are capable of formulating a high-quality precursor solution.
CORROSION RESISTANT MULTILAYER COATINGS
The present invention relates to a multilayer coating on a metal substrate comprising (a) A first distinct layer of a first sol-gel composition disposed over the substrate, wherein the first distinct layer comprises an inorganic oxide, (b) a second distinct layer of a second sol-gel composition disposed over the first distinct layer, wherein the second distinct layer comprises silica and ceria, and (c) a third distinct layer of a third sol-gel composition disposed over the third distinct layer, wherein the third distinct layer comprises at least one alkoxysilane and the process for the preparation of thereof.
IMPROVED PROCESS OF ULTRASONIC SPRAY PYROLYSIS DEPOSITION OF ONE OR MORE ELECTROCHROMIC AND/OR ELECTROLYTIC FILMS ON A SUBSTRATE
A process of making an electrochromic or an electrolytic film by Ultrasonic Spray Pyrolysis (USP) deposition on a substrate comprising: mixing a surfactant to an aqueous precursor solution comprising an electrochromic component or an electrolytic component to provide a spray solution; introducing the spray solution into an ultrasonic spray deposition nozzle at a constant flow rate between 0.1 mL/min and 2 mL/min and applying an ultrasonic frequency between 80 and 120 kHz to generate atomized droplets of the precursor solution; entraining the atomized droplets with a controlled jet of air as gas carrier at a pressure between 0.50 to 2.0 psi, onto a pre-heated substrate at a temperature of 200 to 450° C.; thermally converting the atomized droplets when depositing onto the pre-heated substrate to generate an electrochromic or an electrolytic film.
Non-stick, pyrolytic coatings for heating devices
In accordance with one aspect of the present invention, a heating device is presented. The heating device includes a pyrocatalytic, non-stick coating disposed on at least one surface. The pyrocatalytic non-stick coating includes (i) a binder derived from a silane, a polysiloxane, a polysilazane, or combinations thereof; and (ii) a catalyst dispersed within the binder, wherein the catalyst comprises a pervoskite crystalline material, a pyrochlore crystalline material, a spinel crystalline material, an ilmenite crystalline material, or combinations hereof.
Method for fabrication of crack-free ceramic dielectric films
The invention provides a process for forming crack-free dielectric films on a substrate. The process comprises the application of a dielectric precursor layer of a thickness from about 0.3 μm to about 1.0 μm to a substrate. The deposition is followed by low temperature heat pretreatment, prepyrolysis, pyrolysis and crystallization step for each layer. The deposition, heat pretreatment, prepyrolysis, pyrolysis and crystallization are repeated until the dielectric film forms an overall thickness of from about 1.5 μm to about 20.0 μm and providing a final crystallization treatment to form a thick dielectric film. The process provides a thick crack-free dielectric film on a substrate, the dielectric forming a dense thick crack-free dielectric having an overall dielectric thickness of from about 1.5 μm to about 20.0 μm.