Nanostructured coating materials, methods of their production, and methods of use in a variety of applications are described. The nanostructured materials described herein include one or more 2.sup.+ and/or 3.sup.+ metal ion(s), optionally in a ternary phase, on a substrate.

Nanostructured coating materials, methods of their production, and methods of use in a variety of applications are described. The nanostructured materials described herein include one or more 2.sup.+ and/or 3.sup.+ metal ion(s), optionally in a ternary phase, on a substrate.

The present technology relates to an electrode for electrolysis which has a coating layer containing an ytterbium oxide, wherein the electrode for electrolysis of the present technology is characterized by exhibiting excellent durability and improved overvoltage. Further, the present technology relates to a method of preparing an electrode for electrolysis which includes: applying a coating composition on at least one surface of a metal base, and coating by drying and heat-treating the metal base on which the coating composition has been applied, wherein the coating composition includes a ruthenium precursor and an ytterbium precursor.

A turbine engine part coated in at least a first ceramic layer forming a thermal barrier and including a ceramic material with first ceramic fibers dispersed in the first layer. The first layer may have a chemical composition gradient between a material for forming a thermal barrier and a material for providing protection against calcium and magnesium aluminosilicates, which is present at a greater content in an outer zone of the first layer, and/or the first layer may be porous and may present a porosity gradient such that an outer portion of the first layer presents lower porosity.

A functional ink that includes a precursor sol-gel solution and a solvent is provided. The precursor sol-gel solution is used for forming an oxide dielectric film having a perovskite structure represented by a general formula ABO.sub.3, and has been subjected to a partial hydrolysis process in which a viscosity change resulting from the partial hydrolysis process is controlled to be less than or equal to 50%, and water contained in the precursor sol-gel solution is controlled to be greater than or equal to 0.50 times and less than or equal to 10 times by molar ratio with respect to a B site atom contained in the precursor sol-gel solution. The functional ink has a metal oxide concentration and a viscosity that renders the functional ink suitable for being discharged from a nozzle of a liquid droplet discharge apparatus included in a thin film fabrication apparatus.

[Problem] Provided is an oxide dielectric having superior properties, and a solid state electronic device (for example, a high pass filter, a patch antenna, a capacitor, a semiconductor device, or a microelectromechanical system) including the oxide dielectric.

[Solution] The oxide layer 30 according to the present invention includes an oxide (possibly including inevitable impurities) consisting essentially of bismuth (Bi) and niobium (Nb) and having a crystal phase of the pyrochlore-type crystal structure, in which the number of atoms of the above niobium (Nb) is 1.3 or more and 1.7 or less when the number of atoms of the above bismuth (Bi) is assumed to be 1.

The invention provides a process for forming crack-free dielectric films on a substrate. The process comprises the application of a dielectric precursor layer of a thickness from about 0.3 μm to about 1.0 μm to a substrate. The deposition is followed by low temperature heat pretreatment, prepyrolysis, pyrolysis and crystallization step for each layer. The deposition, heat pretreatment, prepyrolysis, pyrolysis and crystallization are repeated until the dielectric film forms an overall thickness of from about 1.5 μm to about 20.0 μm and providing a final crystallization treatment to form a thick dielectric film. The process provides a thick crack-free dielectric film on a substrate, the dielectric forming a dense thick crack-free dielectric having an overall dielectric thickness of from about 1.5 μm to about 20.0 μm.

Systems and methods of synthesizing nanoparticles on substrates using rapid, high temperature thermal shock. A method involves depositing micro-sized particles or salt precursors on a substrate, and applying a rapid, high temperature thermal pulse or shock to the micro-sized particles or the salt precursors and the substrate to cause the micro-sized particles or the salt precursors to become nanoparticles on the substrate. A system may include a rotatable member that receives a roll of a substrate sheet having micro-sized particles or salt precursors; a motor that rotates the rotatable member so as to unroll consecutive portions of the substrate sheet from the roll; and a thermal energy source that applies a short, high temperature thermal shock to consecutive portions of the substrate sheet that are unrolled from the roll by rotating the first rotatable member. Some systems and methods produce nanoparticles on existing substrate. The nanoparticles may be metallic, ceramic, inorganic, semiconductor, or compound nanoparticles. The substrate may be a carbon-based substrate, a conducting substrate, or a non-conducting substrate. The high temperature thermal shock process may be enabled by electrical Joule heating, microwave heating, thermal radiative heating, plasma heating, or laser heating.

A method for improving the heat resistance of a resistive element embedded in an alumina deposit covering a surface of a substrate, in which the alumina deposit includes a surface portion and a deep portion which is sandwiched between the surface portion and the surface of the substrate and in which the resistive element is located, is provided. The method includes a densification of the surface portion of the alumina deposit.

Provided is a coating liquid for forming a piezoelectric thin film containing lead zirconate titanate, the coating liquid including a complex precursor containing at least three kinds of metal elements of Pb, Ti, and Zr, the coating liquid being free from an exothermic peak at a temperature of 450° C. or more, or having a heat generation amount at a temperature of from 400° C. to 450° C., which is larger than a heat generation amount at a temperature of from 450° C. to 500° C., in differential thermal analysis of the coating liquid.