Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

The present invention provides an apparatus for the deposition of thin films on a substrate, including large substrates, held preferably face-down, in a cartridge containing a liquid solution with at least a chemical precursor which, upon being subject to a uniform microwave field transmitted through a microwave-transparent window, leads to the formation of a thin film on the substrate. The present invention also provides a system for launching microwaves and controlling the process for film deposition on the substrate. The present invention also provides a process for obtaining a film of uniform thickness and characteristics on a substrate or for incorporating controlled non-uniformity. The present invention also provides an apparatus and method for film deposition on a series of substrates in a continuous batch process.

A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.

A coating liquid for forming a metal oxide film, the coating liquid including: a metal source, which is at least one selected from the group consisting of inorganic salts, oxides, hydroxides, metal complexes, and organic acid salts; at least one alkali selected from the group consisting of organic alkalis and inorganic alkalis; and a solvent.

A print head comprising nested chambers for in-situ reactant formation is disclosed. The print head comprises a first chamber nested within a second chamber. The first chamber comprises a first nozzle, the second chamber comprises a second nozzle. The first nozzle is substantially coaxial with the second nozzle. A susceptor to convert electromagnetic energy to heat is within the first chamber. The susceptor comprises one or more openings extending between the upper portion and the lower portion. The susceptor may be heated by induction heating or by optical heating to vaporize a precursor substance within the first chamber. The vapor may react with a reactive gas flowing through the first chamber or expand through a nozzle into a second chamber where the vapor may react with the reactive gas, forming nanoparticles. Patterned films may be written onto a two-dimensional or three-dimensional surfaces.

Disclosed herein are ink compositions for making a conductive palladium structure. For example, the ink composition can comprise a palladium salt and a complex of a complexing agent and a short chain carboxylic acid or salt thereof. In some embodiments, a second or third metal salt is included in the compositions. Also disclosed herein are methods for making and using such conductive ink compositions.

The present invention relates to a process for the preparation of thin silver nano-particles containing layers, which are produced directly on a substrate as part of a coating or printing process. The layers can show different colours in transmittance and reflectance. The invention further relates to decorative and security elements. When the layers are applied over a security element, such as a hologram, the obtained products may show different colours in reflection and transmission, an extremely bright optically variable image (OVD image). Depending on the thickness of the layer a more or less intensive metallic aspect appears.

Methods for depositing materials are described. The methods comprise maintaining a substrate support at a substrate support temperature which is lower than a precursor source temperature. The methods further comprise condensing or depositing a precursor on a substrate, and then curing condensed or deposited precursor to form a layer.

The present disclosure relates to a patternable process for coating functional and adherent graphene-like carbon on multiple substrate types using CO.sub.2 laser-induced photothermal pyrolysis in scanning mode. The poly furfuryl alcohol (PFA) synthesised via low-temperature polymerisation of furfuryl alcohol precursor without any additives was used to form graphene-like carbon material.