The metallization of a metallic rack employed in galvanic metallization processes of plastic material items, coated by immersion in PVC Plastisol, is inhibited thanks to the fact that PVC Plastisol is mixed with a C8-C18 thiol selected from octyl mercaptan, nonyl mercaptan, decyl mercaptan, n-octadecyl-3-mercaptopropionate, isooctyl-3-mercaptopropionate, n-octyl-mercaptopropionate, dodecyl-3-mercaptopropionate, tridecyl-3-mercaptopropionate, palmityl mercaptan, bis-phenyl-1,4-thiol.

The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.

The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 m; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes.