A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

An electronic circuit, comprising: an integrated substrate structure comprising one or more electrically conductive traces comprising plating on a laser-etched, non-conductive isolated portion of the integrated substrate structure defining each electrically conductive trace; one or more electrically conductive pads at one or more predetermined positions along the one or more electrically conductive traces; and an electrical component surface mounted to the at least one electrically conductive pad with interconnect and bonding material.

A metal material comprising: a base material; an oxide layer disposed on a surface of the base material; and a metal layer disposed on a surface of the oxide layer, wherein the base material includes aluminum, the oxide layer includes aluminum, nickel, and oxygen, the metal layer includes nickel, and an average thickness of the oxide layer is no less than 50 nm and no more than 250 nm.

A turbocharger compressor wheel with an aluminum proportion of at least 50 atom percent, produced by. etching a turbine wheel base body using an alkaline etchant to produce a specific etch pitting consisting of nano pores and micropores and chemical deposition of a nickel-phosphorous protective layer (19) onto the etched base body surface.

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

A system for coating an interior surface of a heat exchanger includes a tank for storing the coating solution, a pump, a source line for supplying the coating solution to the heat exchanger, and a return line for returning the remainder of the coating solution to the tank. The system can include a pre-treatment line for supplying a pre-treatment solution to the heat exchanger and a water line for supplying water to the heat exchanger. An air compressor can be coupled to the heat exchanger to force the coating solution, the pre-treatment solution, or the water from the heat exchanger.

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

An article including a substrate having on at least a portion of its surface a multilayer coating. The multilayer coating including at least one layer of electroless nickel overlying the portion of the surface, at least one layer of electrolytic nickel overlying the layer of electroless nickel, and at least one layer of an electrolytic tin-nickel overlying the layer of electrolytic nickel.

A system for coating an interior surface of a heat exchanger includes a tank for storing the coating solution, a pump, a source line for supplying the coating solution to the heat exchanger, and a return line for returning the remainder of the coating solution to the tank. The system can include a pre-treatment line for supplying a pre-treatment solution to the heat exchanger and a water line for supplying water to the heat exchanger. An air compressor can be coupled to the heat exchanger to force the coating solution, the pre-treatment solution, or the water from the heat exchanger.