A method for fabricating magnetic cores, wherein the magnetic cores have at least two materials with different magnetic properties. The materials are selected from a ferrite material, an oxide ceramic material and a superparamagnetic material and are formed alternately in individual regions along the magnetic core.

A package which comprises a first encapsulant configured so that electrically conductive material is plateable thereon, and a second encapsulant configured so that electrically conductive material is not plateable thereon.

A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

In a flow down type surface treating apparatus, a scattering amount of a processing solution is reduced. A film forming mechanism 110 is provided on an inlet side and an outlet side of each treatment chamber. The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.

A framework of copper oxide dendrites is formed on a copper substrate, and these are then coated or plated with silver, gold, or an equivalent metal to create metal-coated dendrites with nano-structures, favorably in range of 50 to 200 nanometers. The framework of metal-coated dendrites are well suited for use in surface-enhanced Raman spectroscopy and other practical applications.

In a flow down type surface treating apparatus, a scattering amount of a processing solution is reduced.

A film forming mechanism 110 is provided on an inlet side and an outlet side of each treatment chamber.

The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.

A framework of copper oxide dendrites is formed on a copper substrate, and these are then coated or plated with silver, gold, or an equivalent metal to create metal-coated dendrites with nano-structures, favorably in range of 50 to 200 nanometers. The framework of metal-coated dendrites are well suited for use in surface-enhanced Raman spectroscopy and other practical applications.

A method for depositing divalent metal compounds on the surface of a nuclear power plant component, the component being a nickel-based or austenitic stainless steel alloy includes: providing within the component an aqueous treatment solution containing at least one soluble metal-containing compound such as a zinc salt and at least one source of oxygen; allowing the treatment solution to remain in the component until the compound is deposited on the wetted surface of the component; and, removing the aqueous solution after exposure. The treatment may be applied more than once, using more than one divalent metal compound, and the surface may further be exposed to a solution containing a noble metal species and a reducing agent. The treatment temperature is preferably below 100? C.

A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

An object of the present invention is to provide a dissimilar metal joined material that has corrosion resistance that can prolong life resulting from corrosion and has a small difference from original characteristics. There is provided a dissimilar metal joined material including: a clad material including a high thermal expansion layer composed of an alloy containing Mn, and a low thermal expansion layer composed of an alloy containing Ni, the low thermal expansion layer being joined directly to the high thermal expansion layer or via an intermediate layer; and a corrosion resistant plating layer provided on at least a surface of the high thermal expansion layer, the corrosion resistant plating layer having a thickness of 10 nm to 120 nm.