C23C18/1855

PLATING METHOD
20170342565 · 2017-11-30 · ·

The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.

Enhanced nickel plating process

A method for plating nickel onto a glass surface of a substrate by sequentially contacting the surface with a solution having an oxidizing agent, a solution containing a silane compound, a Pd/Sn solution, and a nickel ion-containing solution, thereby accomplishing an electroless nickel plating process.

ENHANCED NICKEL PLATING PROCESS
20200148589 · 2020-05-14 ·

A method for plating nickel onto a glass surface of a substrate by sequentially contacting the surface with a solution having an oxidizing agent, a solution containing a silane compound, a Pd/Sn solution, and a nickel ion-containing solution, thereby accomplishing an electroless nickel plating process.

Plating method

The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

Apparatus and methods for electroless surface finishing on glass. A planarization process is performed on buildup dielectric and/or solder resist to create a flatter, more planar, upper surface for a substrate having a glass layer. Planarity is characterized by having surface variations of less than about 5 microns, as measured by recesses and/or protrusions. The planar surface enables finishing the substrate surface with an electroless NiPdAu process.

FUEL TANK FOR USE WITH SPACECRAFT AND MANUFACTURING METHOD THEREOF

A fuel tank for use with a spacecraft, the fuel tank being configured to store therein fuel for driving the spacecraft, includes a carbon fiber reinforced plastic layer and a metallic plating layer, the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, and the metallic plating layer is provided on the polished surface.