The present invention provides a precursor film for producing a conductive film, the precursor film including: a substrate; and a plated layer precursor layer disposed on the substrate, in which the plated layer precursor layer includes a polyfunctional monomer, a monofunctional monomer, and a polymer which has a functional group interacting with a plating catalyst or a precursor of the plating catalyst and has a polymerizable functional group.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

There is provided a method for treating a surface comprising heating the object and the object with a solution comprising a thermal initiator and a polymerizable molecule, wherein the polymerizable molecule reacts with the surface and forms a covalent bond and optionally a covalently bound polymer on the surface of the object. Metal ions are bound to the surface to make the surface possible for adding further metal later. Advantages include that complicated geometries can be coated, problems with oxygen inhibition of the initiator is reduced, and surface reaction to form covalent bonds is promoted compared to the bulk polymerization reaction.

A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

Provided is a method that is for manufacturing a conductive pattern-provided structure, that involves simple manufacturing steps, and that enables formation of a conductive pattern-provided structure having excellent interlayer adhesion. One mode of the present invention provides a method for manufacturing a conductive pattern-provided structure, the method comprising: a coating film formation step for obtaining a coating film by printing, on a base material, a dispersion that contains copper oxide-containing particles; and a plating step for performing electroless plating on the coating film by using a plating solution. The plating solution contains EDTA (ethylenediaminetetraacetic acid).

A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

A coating method for preventing outgassing from an aerospace component made of a resin is proposed. In the coating method for preventing outgassing from the aerospace component, first, a polymer including a resin is provided. After that, primary outgassing in which the polymer is subjected to hot air drying to evaporate gas therefrom is performed. Next, the surface of the polymer after the primary outgassing is subjected to a cold plasma treatment to introduce hydrophilic functional groups so that it is possible to perform plating on the surface of the polymer. After that, the surface of the polymer after the cold plasma treatment is subjected to a catalytic treatment and an activation treatment for post-processes. Next, a first functional metal layer is formed on the surface of the polymer by means of electroless plating to suppress the release of gas through outgassing.

A method of creating a selectively plated three-dimensional thermoplastic part. The method includes the steps of: a) providing a film of uncured polycarbonate film having a hardcoated layer on a first surface thereof; b) selectively catalyzing the polycarbonate film by depositing a catalyst in a desired pattern on the first surface of the polycarbonate film; c) thermoforming the polycarbonate film to form a three-dimensional polycarbonate film; d) UV-curing the hardcoated polycarbonate film by irradiating the film with UV rays; e) molding the hardcoated polycarbonate film to produce a three-dimensional molded part comprising the hardcoated polycarbonate film; f) activating the selectively catalyzed hardcoated polycarbonate film; and g) plating a metal layer on the catalyzed portions of the hardcoated polycarbonate film, wherein the plated metal only deposits on the catalyzed portions of the hardcoated polycarbonate film.

A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

The present invention provides a precursor film for producing a conductive film, the precursor film including: a substrate; and a plated layer precursor layer disposed on the substrate, in which the plated layer precursor layer includes a polyfunctional monomer, a monofunctional monomer, and a polymer which has a functional group interacting with a plating catalyst or a precursor of the plating catalyst and has a polymerizable functional group.