Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Do made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

Provided is a composition for forming a plating base on which plating is applied without a pretreatment, especially any activation process for the plating base, conventionally believed to be necessary, as well as a thus-formed plating base and a method of forming a plating coat over the plating base. The plating base is a coating film formed by applying and drying a metal nanoparticle dispersion liquid or a metal nanoparticle dispersion ink in which metal nanoparticles are protected with a small amount of protecting agent. Thus, a metal film can be formed by plating without operations such as substrate cleaning or catalyst imparting and activating. Since it is not necessary to wash the substrate with acid or base solution or to heat-treat it at a high temperature, many variations of materials become available for the substrate.

The present invention relates to a multi-layered elastomer article and to a method for its manufacturing. The multi-layered article made of an elastomeric composition [composition (C)] comprising at least one elastomer, said article having at least one surface [surface (S)] comprising: —nitrogen-containing groups [groups (N)] and —at least one layer [layer (L1)] adhered to said surface (S) comprising at least one metal compound [compound (M)].

A plasma treatment method is provided. The method includes generating a planar plasma in a plasma treatment chamber, observing an effective influence region of the planar plasma by using an optical observation system in which an observation lens has a transparent substrate and a fluorescent coating thereon, adjusting a location of the observation lens to observe a brightness change of the fluorescent coating and the transparent substrate to obtain a location and a thickness range of the effective influence region of the planar plasma, and then adjusting a location of the observation lens to observe a brightness change of the fluorescent coating and the transparent substrate to obtain a location and a thickness range of the effective influence region of the planar plasma. A location of a sample is adjusted to within the effective influence region, and a plasma treatment is then performed on the sample.

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.

A method for producing metal patterns, which includes depositing a temporary protection on a substrate surface corresponding to the negative of the patterns to be produced; depositing at least one metal on the areas corresponding to the patterns to be produced; and eliminating the temporary protection at least partly during and/or after, or at least partly during and/or after the deposition step. The method can produce decorative objects or functional objects such as printed circuits, integrated circuits, RFID chips, and electronic reader-readable encoding pictograms. A set of consumables used to implement the method is also disclosed.

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

The present invention relates to a method for metallizing a non-metallic substrate, the method comprising the steps (A) to (C), wherein step (A) is a pre-treatment step for etching and step (C) the metallization step. In step (A) a pre-treatment composition is utilized comprising individual manganese (II), (III), and (IV) species. The present invention furthermore relates to a specific pre-treatment composition.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.