An object is to coat a target position on a substrate with a dense film. In order to achieve the object, while a substrate on which a base containing a coating material is formed is transported, an auxiliary agent is applied to the substrate, and then a main agent containing a coating material is applied to the substrate to react the main agent with the auxiliary agent, so that a portion on the substrate where the base is formed is coated with the coating material.

An assembly for electroless metallization of a target surface (11) of at least one workpiece (10), comprising—a container (13) for receiving an electrolyte solution—an inlet for the electrolyte solution, said inlet arranged in the base (15) of the container (13), wherein the inlet (20) is designed as an inlet port (21) with a diffuser plate (24) comprising inlet openings (25) arranged in concentric circles—an outlet (30) which is arranged on an upper side of the container (13)—a receiving area for holding the at least one workpiece (10), wherein the diffuser plate (24) is formed as a first assembly (31) and a second assembly (32), which is identical to the first assembly, of a respective plurality of inlet openings (25), wherein the assemblies at least partially but not completely overlap, and the inlet (20) has at least two inlet ports (21, 22).

An assembly for electroless metallization of a target surface (11) of at least one workpiece (10), comprising—a container (13) for receiving an electrolyte solution—an inlet for the electrolyte solution, said inlet arranged in the base (15) of the container (13), wherein the inlet (20) is designed as an inlet port (21) with a diffuser plate (24) comprising inlet openings (25) arranged in concentric circles—an outlet (30) which is arranged on an upper side of the container (13)—a receiving area for holding the at least one workpiece (10), wherein the diffuser plate (24) is formed as a first assembly (31) and a second assembly (32), which is identical to the first assembly, of a respective plurality of inlet openings (25), wherein the assemblies at least partially but not completely overlap, and the inlet (20) has at least two inlet ports (21, 22).

The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin, binders and reducing agents. Activators of the invention are preferably employed for electroless copper deposition.

The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin, binders and reducing agents. Activators of the invention are preferably employed for electroless copper deposition.

Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

According to a first aspect of the invention, a method for producing a metal-CNT composite material is proposed. The method includes providing a layer of CNT by depositing CNT coated with a polyphenol or poly(catecholamine) coating and filling the interstices of the carbon nanotubes layer with a metal so as to form a metal matrix, in which CNT are embedded. The filling is effected by electrode position or by electroless deposition. The polyphenol or poly(catecholamine) coating is crosslinked by metal ions, the metal ions promoting, as metal seeds, adhesion and/or growth of the metal matrix during the filling step. A further aspect of the invention relates to the metal-CNT composite obtainable by the method.

Disclosed herein are methods for electrolessly coating copper onto a chromium metal powder, the method comprising adding a nickel-coated chromium powder to an aqueous electroless copper plating bath comprising a source of copper cations, a copper-cation complexing agent, a copper-cation reducing agent, and a first base, thereby forming a copper-coated chromium metal powder. Also disclosed are copper-coated chromium metal powders prepared by a disclosed method.