An impeller for a rotary machine includes: a base material of the impeller comprising Al or an Al alloy; a surface layer for the impeller formed by an electroless plating layer comprising a Ni—P based alloy; and an under layer disposed between the base material and the surface layer, the under layer having a smaller Vickers hardness than the surface layer.

An impeller for a rotary machine includes: a base material of the impeller comprising Al or an Al alloy; a surface layer for the impeller formed by an electroless plating layer comprising a Ni—P based alloy; and an under layer disposed between the base material and the surface layer, the under layer having a smaller Vickers hardness than the surface layer.

A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.

A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.

The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.

The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxo-ions thereof, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state; complexing agents CA1, CA2, CA3, and CA4, wherein CA1, CA2, CA3, and CA4 are all different from each other, wherein each of CA1 and CA2 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned; wherein CA3 is selected from the group consisting of aliphatic compounds having exactly one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned; and wherein CA4 is selected from the group consisting of aromatic compounds having at least one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history.

The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.

The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history.

The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.

A method of removing a plurality of portions of a black layer of an electrical conduit for a photovoltaic cell is disclosed. The method includes providing a mandrel having the electrical conduit electroformed in the mandrel. The electrical conduit is formed in a preformed pattern on an outer surface of the mandrel. The electrical conduit has the black layer with a black layer thickness on a side opposite of the outer surface of the mandrel. A beam of a laser is controlled toward the black layer of the electrical conduit. The beam is characterized by laser parameters. The beam of the laser removes the plurality of portions of the black layer on the electrical conduit. Each removed portion of the plurality of portions of the black layer has a thickness equal to the black layer thickness, and a portion area of 5 mm.sup.2 to 20 mm.sup.2.