An igniter of a passenger protection device has at least one metal pin for contacting the tripping unit of the passenger protection device. The metal pin has a contact end that can be coupled to the tripping unit. The metal pin has a gold coating with a layer thickness. A maximum layer thickness is present at a distance of at least 1 mm from the contact end.

The present disclosure provides a cold-rolled steel sheet having excellent high-temperature properties and room-temperature workability, including, by weight: carbon (C): 0.0005 to 0.003%, manganese (Mn): 0.20 to 0.50%, aluminum (Al): 0.01 to 0.10%, phosphorus (P): 0.003 to 0.020%, nitrogen (N): 0.0005 to 0.004%, sulfur (S): 0.015% or less, niobium (Nb): 0.005 to 0.040%, chromium (Cr): 0.10 to 0.50%, tungsten (W): 0.02 to 0.07%, and a balance of iron (Fe) and other inevitable impurities, wherein C, Nb, and W satisfy the following relationship 1, a microstructure comprises 95 area % or more of polygonal ferrite and 5 area % or less of acicular ferrite, and the cold-rolled steel sheet comprises (Nb,W)C-based precipitates having an average size of 0.005 to 0.10 μm and a method for manufacturing the same:
0.00025≤(2×Nb/93)×(W/184)/(C/12)≤0.0015  [Relationship 1]
where, C, Nb, and W are in weight %.

The present disclosure provides a hot-press formed part comprising a plated steel sheet and an aluminum alloy plated layer formed on the plated steel sheet, wherein the aluminum alloy plated layer comprises: an alloying layer (I) formed on the plated steel sheet and containing, by weight %, 5-30% of Al; an alloying layer (II) formed on the alloying layer (I) and containing, by weight %, 30 to 60% of Al; an alloying layer (III) formed on the alloying layer (II) and containing, by weight %, 20-50% of Al and 5-20% of Si; and an alloying layer (IV) formed continuously or discontinuously on at least a part of the surface of the alloying layer (III), and containing 30-60% of Al, wherein the rate of the alloying layer (III) exposed on the outermost surface of the aluminum alloy plated layer is 10% or more.

A hot stamped component, includes: a base material; and a Zn-based plating layer provided in contact with the base material as an upper layer of the base material and containing Zn and Ni. A region of the Zn-based plating layer on a base material side is a Fe—Zn solid solution containing Ni, and two or more twins exist in 10 crystal grains of the Fe—Zn solid solution containing Ni adjacent to an interface between the base material and the Zn-based plating layer.

A method comprising: cold-spraying a surface of a substrate with a bond material to form a bond coating; and cold-spraying a surface of the bond coating with a coating material to form a top coating. The bond material is different from the coating material and harder than the surface of the substrate.

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

An elongated hollow component includes a body extending from a first end to a second end and defining a longitudinal axis. The body includes a plurality of layers each circumscribing the longitudinal axis. The plurality of layers includes a base layer including a first steel material, and an inner surface coating coupled to a radially inner surface of the base layer. The inner surface coating includes a second steel material.

A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member including an overlay formed of an alloy plating film of Bi and Sb, wherein Bi—Sb oxide is formed on a surface of the overlay.