A cutting tool includes a substrate; and a coating film, wherein the coating film includes a multilayer structure layer having first unit layer(s) and second unit layer(s), the first unit layer(s) and the second unit layer(s) are alternately layered, under a condition X-ray diffraction intensities of different planes in the multilayer structure layer are respectively represented by I.sub.(200), I.sub.(111), and I.sub.(220), the following formula 0.6≤I.sub.(200)/{I.sub.(200)+I.sub.(111)+I.sub.(220)}, the first unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.1c in a c-axis direction is larger than an interplanar spacing d.sub.1a in an a-axis direction, the second unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.2c in the c-axis direction is smaller than an interplanar spacing d.sub.2a in the a-axis direction, and the following formulas are satisfied as well 1≤d.sub.1a/d.sub.2a≤1.02, 1.01≤d.sub.1c/d.sub.2c≤1.05, and d.sub.1a/d.sub.2a<d.sub.1c/d.sub.2c.

Systems, methods, and apparatus for encapsulating objects like that of microelectronic components and batteries. The system includes three successive layers that include a first covering layer composed of an electrically insulating material deposited by atomic layer deposition, which at least partly covers the object, a second covering layer that includes parylene and/or polyimide, and which is disposed on the first covering layer, and a third covering layer deposited on the second covering layer in such a way as to protect the second encapsulation layer, namely, with respect to oxygen, and thereby increase the service life of the object.

Methods of forming memory structures are discussed. Specifically, methods of forming 3D NAND devices are discussed. Some embodiments form memory structures with a metal nitride barrier layer, an α-tungsten layer, and a bulk metal material. The barrier layer comprises a TiXN or TaXN material, where X comprises a metal selected from one or more of aluminum (Al), silicon (Si), tungsten (W), lanthanum (La), yttrium (Yt), strontium (Sr), or magnesium (Mg).

Provided is a coated cutting tool in which a surface of a substrate is coated with a hard coating film. The hard coating film includes: a layer (A) disposed on the surface of the substrate, and having a face-centered cubic lattice structure, in which the total content ratio of W and Ti is at least 85 atomic %, and which contains W as the most abundant element and Ti as the next most abundant element among metal (including metalloid) elements; and a layer (B) disposed on the layer (A) and having a face-centered cubic lattice structure, which is composed of nitrides or carbonitrides containing Al, Cr, and Si, and in which, among metal (including metalloid) elements, the Al content ratio is at least 50 atomic %, the total content ratio of Al and Cr is at least 85 atomic %, and the Si content ratio is 4 to 15 atomic %.

Provided is a coated cutting tool having improved wear resistance and fracture resistance and a prolonged tool life. The coated cutting tool includes a substrate and a coating layer formed on the substrate. The coating layer includes a first layer containing Ti(C.sub.x1N.sub.1-x1) and a second layer containing (Ti.sub.1-y1Al.sub.y1)N, particles in the first layer have an average particle size of 5 nm or more and less than 100 nm, 1.0≤I(111)/I(200)≤20.0 in the first layer, the first layer has an average thickness of 5 nm or more and 1.0 μm or less, 0.1≤I(111)/I(200)≤1.0 in the second layer, particles in the second layer have an average particle size of more than 100 nm and 300 nm or less, and the second layer has an average thickness of 5 nm or more and 2.0 μm or less.

The present disclosure relates to coated non-metallic substrates and coated metallic substrates, and methods for producing such coated substrates. A variant of the method is characterized in that a mat or glossy coating is underneath a metallic layer obtained in some cases by way of vapor deposition and/or sputtering. In another variant, the metallic is sufficiently thin so that it remains transparent or translucent to visible light. The coated substrates may include multiple layers such as metallic layers, polysiloxane layers, a color layer, a conversion layer, a primer layer, and/or a transparent or colored layer. An application system for applying a metallic layer to at least one surface of a substrate may include a plasma generator and/or a corona system for treating one or more layers by plasma treatment and/or corona treatment.

A bioactive coated substrate includes a base substrate, a first interlayer disposed over the base substrate, an outermost bioactive layer disposed on the first interlayer, and a topcoat layer disposed on the outermost bioactive layer. Characteristically, a plurality of microscopic openings extending through the topcoat layer and the outermost bioactive layer expose the first interlayer and the outermost bioactive layer. A method for forming the bioactive coated substrate is also provided.

Embodiments described and discussed herein provide methods for selectively depositing a metal oxides on a substrate. In one or more embodiments, methods for forming a metal oxide material includes positioning a substrate within a processing chamber, where the substrate has passivated and non-passivated surfaces, exposing the substrate to a first metal alkoxide precursor to selectively deposit a first metal oxide layer on or over the non-passivated surface, and exposing the substrate to a second metal alkoxide precursor to selectively deposit a second metal oxide layer on the first metal oxide layer. The method also includes sequentially repeating exposing the substrate to the first and second metal alkoxide precursors to produce a laminate film containing alternating layers of the first and second metal oxide layers. Each of the first and second metal alkoxide precursors contain different types of metals which are selected from titanium, zirconium, hafnium, aluminum, or lanthanum.

The present disclosure appropriately shortens a processing step for processing a substrate in which a silicon layer and a silicon germanium layer are alternatively laminated. The present disclosure provides a substrate processing method of processing the substrate in which the silicon layer and the silicon germanium layer are alternatively laminated, which includes forming an oxide film by selectively modifying a surface layer of an exposed surface of the silicon germanium layer by using a processing gas including fluorine and oxygen and converted into plasma.

The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.