A chemical liquid treatment apparatus includes processing chambers; a chemical liquid feeding unit configured to cyclically feed a chemical liquid into the processing chambers; and a modifying unit. The modifying unit, when using a chemical liquid in which an effect thereof varies with a chemical liquid discharge time, is configured to calculate a variation of the effect of the chemical liquid based on the chemical liquid discharge time and is configured to modify the chemical liquid discharge time for each of the processing chambers based on the calculated variation of the effect of the chemical liquid and a cumulative time of the chemical liquid discharge time.

An etching method for quickly removing a seed layer that is formed of titanium and/or a titanium alloy, while suppressing dissolution of other metals from copper wiring lines and the like, for continuous and stable processing; and a composition which is used for this etching method. The composition comprises, based on a total amount of the composition, 0.01 to 0.23% by mass hydrogen peroxide, 0.2 to 3% by mass fluoride, 0.0005 to 0.025% by mass of a halide ion other than a fluoride ion, and water. A method for using the composition to produce a substrate is also described.

An etchant composition that is capable of batch etching treatment of a tungsten film and a titanium nitride film and a method for etching using said etchant composition are provided. The etching composition of the present invention is an etchant composition comprising nitric acid and water for batch etching treatment of a tungsten film and a titanium nitride film.

An etchant composition that is capable of batch etching treatment of a tungsten film and a titanium nitride film and a method for etching using said etchant composition are provided. The etching composition of the present invention is an etchant composition comprising nitric acid and water for batch etching treatment of a tungsten film and a titanium nitride film.

An etchant composition for etching a triple layer metal wiring structure of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum alloy, and a use thereof are disclosed. The etchant composition includes hydrogen peroxide, glycol, an etching inhibitor, a chelating agent, an etching additive, a pH adjuster, and water, The etchant can not only slow down the decomposition of hydrogen peroxide, but also extend the lifespan of the etchant, thereby greatly reducing the costs of the etchant in the manufacturing process, and improving the safety factor of the etchant.

An etchant composition for etching a triple layer metal wiring structure of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum alloy, and a use thereof are disclosed. The etchant composition includes hydrogen peroxide, glycol, an etching inhibitor, a chelating agent, an etching additive, a pH adjuster, and water, The etchant can not only slow down the decomposition of hydrogen peroxide, but also extend the lifespan of the etchant, thereby greatly reducing the costs of the etchant in the manufacturing process, and improving the safety factor of the etchant.

Described herein is an etching solution suitable for both tungsten-containing metals and TiN-containing materials, which comprises: water; and one or more than one oxidizers; and one or more than one of the components selected from the group consisting of: one or more fluorine-containing-etching compounds, one or more organic solvents, one or more chelating agents, one or more corrosion inhibitors and one or more surfactants.

Described herein is an etching solution suitable for both tungsten-containing metals and TiN-containing materials, which comprises: water; and one or more than one oxidizers; and one or more than one of the components selected from the group consisting of: one or more fluorine-containing-etching compounds, one or more organic solvents, one or more chelating agents, one or more corrosion inhibitors and one or more surfactants.

A method for constructing a three-dimensional multi-scale surface to obtain controlled and improved physical and chemical configurations to promote the integration of orthopedic and/or dental implants, to human and/or animal tissues, in different shapes and geometries in a versatile manner, and can be applied to all types of metals, metal alloys and/or ceramic compounds. This method includes the modification at the macroscopic level of the roughness, with an objective of promoting the mechanical interlocking of the implant, followed by the modification of the surface for the formation of microtopography, then the microtopography is changed to obtain a nanotopography with characteristics that optimize cellular metabolic responses related to attraction, adhesion, spreading, proliferation and cell growth, in addition to phenotypic and genotypic inductions in undifferentiated cells and in osteoblast lineage, responsible for mineralization and bone neoformation. As a result, the interface between implant and bone is improved.

A method for constructing a three-dimensional multi-scale surface to obtain controlled and improved physical and chemical configurations to promote the integration of orthopedic and/or dental implants, to human and/or animal tissues, in different shapes and geometries in a versatile manner, and can be applied to all types of metals, metal alloys and/or ceramic compounds. This method includes the modification at the macroscopic level of the roughness, with an objective of promoting the mechanical interlocking of the implant, followed by the modification of the surface for the formation of microtopography, then the microtopography is changed to obtain a nanotopography with characteristics that optimize cellular metabolic responses related to attraction, adhesion, spreading, proliferation and cell growth, in addition to phenotypic and genotypic inductions in undifferentiated cells and in osteoblast lineage, responsible for mineralization and bone neoformation. As a result, the interface between implant and bone is improved.