A method of etching a metal includes performing at least two cycles of an etch process. A cycle of the etch process includes: performing a surface modification on an exposed surface of a metal layer over a substrate, performing a hydrogen treatment on the metal layer, and performing a cleaning treatment on the metal layer. The hydrogen treatment forms a layer of reaction products on the metal layer. The cleaning treatment removes the layer of reaction products.

A pressure vessel has a first end with a first boss, the first boss having a first outer surface. The vessel includes a liner having a second outer surface, a shell disposed over the second outer surface, and a first vent. The first vent is formed onto at least a portion of the first outer surface and at least a portion of the second outer surface. The first vent includes a texture that provides a higher rate of gas flow through the first vent than through a portion of an interface of the liner and shell lacking the texture. In another aspect, a pressure vessel has a first end and a second end, a plurality of first longitudinal vents and a plurality of second longitudinal vents. At least one of first longitudinal vents is circumferentially offset around the pressure vessel from at least one of the second longitudinal vents.

Implementations disclosed herein provide a method of reducing the topography at the alignment and overlay marks area during the writer pole photolithography process in order to reduce the wafer scale variation and reduce the writer pole photolithography process rework rate. In one implementation, an intermediate stage of a wafer for writer pole formation is generated by removing a part of at least one metallic writer pole layer on top of an intermediate stage writer pole wafer to form a recovery trench, depositing an optically transparent material on top of the wafer, wherein the thickness of the optically transparent material is higher than a target recovery trench topography, forming a photoresist pattern on top of the optically transparent material over the recovery trench, etching the optically transparent material, and removing the photoresist pattern and at least part of the remaining optically transparent material.

Implementations disclosed herein provide a method of reducing the topography at the alignment and overlay marks area during the writer pole photolithography process in order to reduce the wafer scale variation and reduce the writer pole photolithography process rework rate. In one implementation, an intermediate stage of a wafer for writer pole formation is generated by removing a part of at least one metallic writer pole layer on top of an intermediate stage writer pole wafer to form a recovery trench, depositing an optically transparent material on top of the wafer, wherein the thickness of the optically transparent material is higher than a target recovery trench topography, forming a photoresist pattern on top of the optically transparent material over the recovery trench, etching the optically transparent material, and removing the photoresist pattern and at least part of the remaining optically transparent material.

Systems and methods disclosed herein relate to texturing a metal surface. A method for texturing a metal surface comprises disposing a first ceramic coating onto a first surface on the metal surface, applying a media to the first ceramic coating, disposing a second ceramic coating onto the media, and/or heat treating the metal surface for an end duration.

Systems and methods disclosed herein relate to texturing a metal surface. A method for texturing a metal surface comprises disposing a first ceramic coating onto a first surface on the metal surface, applying a media to the first ceramic coating, disposing a second ceramic coating onto the media, and/or heat treating the metal surface for an end duration.

A device and method for generating an electrical discharge are described. A first electrode (30) is operated to be a cathode relative to a second electrode (16). A gas is introduced into the chamber (14) by the first electrode (30). The first electrode (30) has a closed antechamber (32) with a metal wall (34). A tube (36) consisting of a different material than the wall (34) is provided through which the gas from the antechamber (32) is conducted into the chamber (14). A front portion of the tube (36) is embedded in the wall (34) of the antechamber (32). In its rear portion, the tube (36) has a free end projecting into the antechamber (32). A stable electrical discharge can be generated thereby in a particularly easy manner.

A device and method for generating an electrical discharge are described. A first electrode (30) is operated to be a cathode relative to a second electrode (16). A gas is introduced into the chamber (14) by the first electrode (30). The first electrode (30) has a closed antechamber (32) with a metal wall (34). A tube (36) consisting of a different material than the wall (34) is provided through which the gas from the antechamber (32) is conducted into the chamber (14). A front portion of the tube (36) is embedded in the wall (34) of the antechamber (32). In its rear portion, the tube (36) has a free end projecting into the antechamber (32). A stable electrical discharge can be generated thereby in a particularly easy manner.

A method for preparing a three-dimensional porous graphene material, including: a) constructing a CAD model corresponding to a required three-dimensional porous structure, and designing an external shape and internal structure parameters of the model; b) based on the CAD model, preparing a three-dimensional porous metal structure using a metal powder as material; c) heating the three-dimensional porous metal structure and preparing a metal template of the required three-dimensional porous structure; d) placing the metal template in a tube furnace and heating the metal template to a temperature of between 800 and 1000° C.; standing for 0.5-1 hr, introducing a carbon source to the tube furnace for continued reaction, cooling resulting products to room temperature to yield a three-dimensional graphene grown on the metal template; and e) preparing a corrosive solution, and immersing the three-dimensional graphene in the corrosive solution.

A method for preparing a three-dimensional porous graphene material, including: a) constructing a CAD model corresponding to a required three-dimensional porous structure, and designing an external shape and internal structure parameters of the model; b) based on the CAD model, preparing a three-dimensional porous metal structure using a metal powder as material; c) heating the three-dimensional porous metal structure and preparing a metal template of the required three-dimensional porous structure; d) placing the metal template in a tube furnace and heating the metal template to a temperature of between 800 and 1000° C.; standing for 0.5-1 hr, introducing a carbon source to the tube furnace for continued reaction, cooling resulting products to room temperature to yield a three-dimensional graphene grown on the metal template; and e) preparing a corrosive solution, and immersing the three-dimensional graphene in the corrosive solution.