The present invention is directed towards an aqueous alkaline cleaner composition comprising: an iron cation, a molybdenum cation, a cobalt cation, or combinations thereof; and an alkaline component; wherein the pH of the aqueous alkaline composition is at least 10, and the aqueous alkaline composition includes no more than 50 ppm of phosphate. Also disclosed are treatment systems comprising an aqueous alkaline composition for treating at least a portion of a substrate, and a pretreatment composition for treating at least a portion of a substrate. Also disclosed are substrates treated according to the disclosed treatment systems.

The present invention is directed towards an aqueous alkaline cleaner composition comprising: an iron cation, a molybdenum cation, a cobalt cation, or combinations thereof; and an alkaline component; wherein the pH of the aqueous alkaline composition is at least 10, and the aqueous alkaline composition includes no more than 50 ppm of phosphate. Also disclosed are treatment systems comprising an aqueous alkaline composition for treating at least a portion of a substrate, and a pretreatment composition for treating at least a portion of a substrate. Also disclosed are substrates treated according to the disclosed treatment systems.

The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 μg/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 MΩ.Math.cm.

The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 μg/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 MΩ.Math.cm.

The present disclosure provides a new wet atomic layer etch (ALE) process for etching ruthenium. More specifically, the present disclosure provides various embodiments of methods that utilize new etch chemistries for etching ruthenium in a wet ALE process. Unlike conventional etch processes for ruthenium, the wet ALE process described herein for etching ruthenium is metal-free, cost-effective and improves surface roughness during etching.

The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

A steel sheet coated with a zinc-based coating layer having a reaction layer on the surface of the steel sheet is manufactured by a method that includes bringing a steel sheet coated with a zinc-based coating layer into contact for 1.0 second or more with an alkaline aqueous solution containing one or more chelating agents selected from among sodium gluconate, sodium glucoheptonate, sodium citrate, tartaric acid, arabonic acid, galactonic acid, sorbit, mannite, glycerin, EDTA, and sodium tripolyphosphate in a total amount of 0.050 mass % or more and having a pH of 10.0 or more as a pre-treatment before a formation of the reaction layer, and forming the reaction layer being an oxide layer containing a crystal-structured substance expressed by Zn.sub.4(SO.sub.4).sub.1-X(CO.sub.3).sub.X(OH).sub.6.nH.sub.2O.

There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.

There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.