C25D11/005

Plasma electrolytic oxidation apparatus and method of plasma electrolytic oxidation using the same

In a plasma electrolytic oxidation apparatus and a method of plasma electrolytic oxidation using the plasma electrolytic oxidation apparatus, the plasma electrolytic oxidation apparatus includes a chamber and an electrode unit. The chamber is configured to receive an electrolyte. The electrode unit is configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment. The electrode unit includes an electrode, an enclosing part and a cover. The electrode is configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object. The enclosing part is configured to enclose a gap between the electrode and the object. The cover is configured to cover the electrode.

MULTIPLE WAFER SINGLE BATH ETCHER
20180005853 · 2018-01-04 ·

An etcher comprises a bath, a plurality of blades, and a tunnel. The bath includes a first electrode at a first end and a second electrode at a second end. The plurality of blades is configured to fit in the bath. At least one blade of the plurality of blades holds a wafer. At least one tunnel is configured to fit between adjacent blades of the plurality of blades in the bath.

METHOD FOR PASSIVATING A TINPLATE STRIP AND APPARATUS FOR PRODUCING SAID PASSIVATED TINPLATE STRIP

A method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing the passivated tinplate strip.

Electrode for an eloxal process
11542628 · 2023-01-03 · ·

The present disclosure relates to an electrode for eloxing a component, in particular a component of a vehicle brake system, comprising an electrolyte inlet for feeding an electrolyte into the electrode, an inlet channel, which connects the electrolyte inlet to an electrolyte outlet opening formed in the region of an outer surface of the electrode, an electrolyte inlet opening formed in the region of the outer surface of the electrode at a distance from the electrolyte outlet opening, an electrolyte flow path, which runs between the electrolyte outlet opening and the electrolyte inlet opening along the outer surface of the electrode and is designed to bring a surface portion of the component, which surface portion is to be eloxed, into fluid contact with the electrolyte flowing through the electrolyte flow path, an outlet channel, and an electrolyte outlet.

Assemblies and methods for anodizing a workpiece selectively using a combination of a mechanical mask and a gas bubble or air pocket mask
11535948 · 2022-12-27 ·

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

Anodized part having low reflectance of visible and near-infrared light

This application relates to an enclosure for a portable electronic device. The enclosure includes a metal substrate, and an anodized layer overlaying the metal substrate and including pores having a near-infrared (NIR) light-absorbing material therein, where an average specular reflectance of NIR light that is incident upon an external surface of the anodized layer is less than 3%.

ELECTROLYTIC PROCESSING OF METALLIC SUBSTRATES

Provided herein are methods and systems for electrolytic processing of metallic substrates, such as aluminum alloys. The disclosure provides methods of making an anodized substrate by anodizing a metallic substrate in an electrolyte solution comprising phosphoric acid. In particular, the disclosure describes various conditions for anodizing the metallic substrate, including temperature, acid concentration, and voltage. The disclosure also provides systems for carrying out described methods.

Methods and apparatuses for forming metal oxide nanostructures

Embodiments of methods and apparatuses for forming the metal oxide nanostructure on surfaces are disclosed. In certain embodiments, the nanostructures can be formed on a substrate made of a nickel titanium alloy, resulting in a nanostructure that can include both titanium oxide and nickel oxide. The nanostructure can be formed on the surface(s) of an implantable medical device, such as a stent.

Nanowire cluster and template and method for nanowire cluster formation

A cluster of non-collapsed nanowires, a template to produce the same, methods to obtain the template and to obtain the cluster by using the template, and devices having the cluster. The cluster and the template both have an interconnected region and an interconnection-free region.

Component of substrate processing apparatus and method for forming a film thereon
09828690 · 2017-11-28 · ·

A component of a substrate processing apparatus that performs plasma processing on a substrate includes a base mainly formed of an aluminum alloy containing silicon. A film is formed on the surface of the base by an anodic oxidation process which includes connecting the component to an anode of a power supply and immersing the component in a solution mainly formed of an organic acid. The film is impregnated with ethyl silicate.