In a plasma electrolytic oxidation apparatus and a method of plasma electrolytic oxidation using the plasma electrolytic oxidation apparatus, the plasma electrolytic oxidation apparatus includes a chamber and an electrode unit. The chamber is configured to receive an electrolyte. The electrode unit is configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment. The electrode unit includes an electrode, an enclosing part and a cover. The electrode is configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object. The enclosing part is configured to enclose a gap between the electrode and the object. The cover is configured to cover the electrode.

The present disclosure is related to jars and containers and, more particularly, to the manufacture of readily recyclable jars and containers.

An exemplary jar is comprised of an aluminum base and a first aluminum inner cup provided with a first cavity defined with the aluminum base. An outer thread is provided about an exterior surface of the aluminum base, and an aluminum lid with a second aluminum inner cup is provided within a second cavity defined within the aluminum lid. An inner thread mateable with the outer thread is provided about an interior surface of the second aluminum inner cup.

A method of manufacturing readily recyclable jars can comprise providing a primary metal material and optionally applying a precoating to the primary metal material. The primary metal material may be formed into a jar with mating threads and a lid with mating threads. The primary metal material may optionally be finished. A liner may optionally be inserted. The lid and jar are then assembled, and a plastic cup may optionally be installed.

The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

Exemplary methods of coating a semiconductor component substrate may include submerging the semiconductor component substrate in an alkaline electrolyte. The alkaline electrolyte may include yttrium. The methods may include igniting a plasma at a surface of the semiconductor component substrate for a period of time less than or about 12 hours. The methods may include forming a yttrium-containing oxide on the semiconductor component substrate. A surface of the yttrium-containing oxide may be characterized by a yttrium incorporation of greater than or about 10 at. %.

Method for manufacturing a fire-resistant part of an air conditioning system for an air or rail transport vehicle, characterized in that it includes at least the following steps: a step of obtaining a part including at least one aluminum alloy surface portion, and a step of treating the aluminum alloy surface portion by use of micro-arc oxidation in order to produce a ceramic coating on the surface portion.

The present disclosure is related to jars and containers and, more particularly, to the manufacture of readily recyclable jars and containers. An exemplary jar is comprised of an aluminum base and a first aluminum inner cup provided with a first cavity defined with the aluminum base. An outer thread is provided about an exterior surface of the aluminum base, and an aluminum lid with a second aluminum inner cup is provided within a second cavity defined within the aluminum lid. An inner thread mateable with the outer thread is provided about an interior surface of the second aluminum inner cup. A method of manufacturing readily recyclable jars can comprise providing a primary metal material and optionally applying a precoating to the primary metal material. The primary metal material may be formed into a jar with mating threads and a lid with mating threads. The primary metal material may optionally be finished. A liner may optionally be inserted. The lid and jar are then assembled, and a plastic cup may optionally be installed.

A heating apparatus, a non-combusted heating device and a method for manufacturing the same are disclosed. In certain aspects, the heating apparatus includes a casing with an end for receiving a product to be heated, a heating element at least partially disposed within the casing, and an insulation layer formed between an internal surface of the casing and an external surface of the heating element. The insulation layer includes a polycrystalline material having a valve metal oxide.

This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.