A slide member having a slide surface coated with a lacquer including a resin. The lacquer is in turn at least partly coated with a lipophilic composition coating. The lipophilic composition coating provides a slide layer on the slide member with low friction.

A slide member having a slide surface coated with a lacquer including a resin. The lacquer is in turn at least partly coated with a lipophilic composition coating. The lipophilic composition coating provides a slide layer on the slide member with low friction.

An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.

An object of the present invention is to provide an aluminum plate which is excellent in terms of both step suitability and working characteristics and a collector for a storage device using the same. The aluminum plate of the present invention is an aluminum plate having a plurality of through-holes formed in a thickness direction, in which a thickness of the aluminum plate is 40 μm or less, an average opening diameter of the through-holes is 0.1 to 100 μm, an average opening ratio by the through-holes is 2% to 30%, a content of Fe is 0.03% by mass or more, and a ratio of the content of Fe to a content of Si is 1.0 or more.

The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

Template-guided growth of carbon nanotubes using anodized aluminum oxide nanopore templates provides vertically aligned, untangled planarized arrays of multiwall carbon nanotubes with Ohmic back contacts. Growth by catalytic chemical vapor deposition results in multiwall carbon nanotubes with uniform diameters and crystalline quality, but varying lengths. The nanotube lengths can be trimmed to uniform heights above the template surface using ultrasonic cutting, for example. The carbon nanotube site density can be controlled by controlling the catalyst site density. Control of the carbon nanotube site density enables various applications. For example, the highest possible site density is preferred for thermal interface materials, whereas, for field emission, significantly lower site densities are preferable.

A solid electrolytic capacitor is obtained by a method comprising dissolving a polymerizable material for being converted into a conductive polymer in a water-soluble organic solvent to obtain a solution, adding the solution to water while homogenizing the solution to obtain a sol, immersing an anode body having a dielectric layer in the surface of the anode body in the sol, and applying voltage using the anode body as a positive electrode and a counter electrode as a negative electrode placed in the sol to electropolymerize the polymerizable material. An electropolymerizable liquid for producing a conductive polymer, the liquid composed of a sol comprising water, a water-soluble organic solvent, and a polymerizable material for being converted into the conductive polymer.

A solid electrolytic capacitor is obtained by a method comprising dissolving a polymerizable material for being converted into a conductive polymer in a water-soluble organic solvent to obtain a solution, adding the solution to water while homogenizing the solution to obtain a sol, immersing an anode body having a dielectric layer in the surface of the anode body in the sol, and applying voltage using the anode body as a positive electrode and a counter electrode as a negative electrode placed in the sol to electropolymerize the polymerizable material. An electropolymerizable liquid for producing a conductive polymer, the liquid composed of a sol comprising water, a water-soluble organic solvent, and a polymerizable material for being converted into the conductive polymer.

A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.

The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.