A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

The present invention relates to a method of improving the corrosion resistance of a metal substrate surface using an oxygen reduction catalyst, which may improve the corrosion resistance of the metal substrate surface by coating the metal substrate surface with the oxygen reduction catalyst so that the metal substrate surface is changed to a passive state through the action of the oxygen reduction catalyst in an environment in which a stable oxide layer is not spontaneously formed on the metal substrate surface. The present invention has an advantage in that it can dramatically improve the corrosion resistance of the metal substrate under a corrosive environment by allowing a recoverable oxide layer to be formed on the metal substrate surface through the action of the oxygen reduction catalyst, applied to the surface, even in an environment in which an oxide layer is not spontaneously formed on the metal substrate.

The present invention relates to a method of improving the corrosion resistance of a metal substrate surface using an oxygen reduction catalyst, which may improve the corrosion resistance of the metal substrate surface by coating the metal substrate surface with the oxygen reduction catalyst so that the metal substrate surface is changed to a passive state through the action of the oxygen reduction catalyst in an environment in which a stable oxide layer is not spontaneously formed on the metal substrate surface. The present invention has an advantage in that it can dramatically improve the corrosion resistance of the metal substrate under a corrosive environment by allowing a recoverable oxide layer to be formed on the metal substrate surface through the action of the oxygen reduction catalyst, applied to the surface, even in an environment in which an oxide layer is not spontaneously formed on the metal substrate.

The present invention relates to metals or metal alloys comprising a protective silicate glass-like coating, and methods for coating the metals or metal alloys. The methods comprise removal of any existing oxide layer from the metal or metal alloy, formation of a new oxide layer on the metal or metal alloy using chemical passivation or exposure to a gaseous oxidising environment, coating the oxidised metal or metal alloy with an aqueous silicate solution, and curing the coating.

The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

A method of preparing a modified-metal surface. The method includes preparing a solution of a phosphorous-based acid in a solvent; immersing a strip of the metal work piece into the solution of the phosphorous-based acid; immersing a strip of a reference metal into the solution of the phosphorous-based acid; supplying a voltage for a duration of time to prepare a phosphorous acid-modified metal work piece; removing the phosphorous acid-modified metal work piece; cleaning and drying the phosphorous acid-modified metal work piece; applying a chitosan solution to the surface in order to attach chitosan/modified chitosan to the phosphorous acid based modified surface; prepare the modified-metal surface; and cleaning and drying the modified-metal surface.

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.

According to various embodiments of the disclosure, an electronic device may include: a housing, a processor disposed inside the housing, the housing may include a metal member comprising a metal and including a first convex and concave pattern formed in a shape corresponding to a shape of a second convex and concave pattern formed on a jig, wherein the jig is formed for use in electro chemical machining (ECM), and the first convex and concave pattern may have at least a portion formed at a substantially uniform pitch and a substantially uniform height.