The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

A method of preparing a modified-metal surface. The method includes preparing a solution of a phosphorous-based acid in a solvent; immersing a strip of the metal work piece into the solution of the phosphorous-based acid; immersing a strip of a reference metal into the solution of the phosphorous-based acid; supplying a voltage for a duration of time to prepare a phosphorous acid-modified metal work piece; removing the phosphorous acid-modified metal work piece; cleaning and drying the phosphorous acid-modified metal work piece; applying a chitosan solution to the surface in order to attach chitosan/modified chitosan to the phosphorous acid based modified surface; prepare the modified-metal surface; and cleaning and drying the modified-metal surface.

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between 1 to 50 microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between 8 and 14, applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.

In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between 1 to 50 microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between 8 and 14, applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.

A method for producing metal-polymer composites which include at least one metal part and at least one part made of a polymer composition, the method including the steps of: treating the surface of at least one metal part at least partially with a solution of triazine thiol derivative to obtain a treated metal surface; and contacting the treated metal surface at least partially with at least one polymer composition so as to obtain a metal-polymer composite, wherein the polymer composition includes at least one semi-crystalline polyamide. Also, a metal-polymer composite that includes at least one part made of a polymer composition and at least one metal part and that is obtainable by the method and to a product including the metal-polymer composite.

Articles having functional surfaces, for example antimicrobial functional surfaces, are prepared by methods comprising anodization. Organophosphorous compounds are deposited on a surface by methods comprising anodization, followed by attaching functional compounds, functional oligomers or functional polymers. Alternatively, functional organophosphorous compounds, functional oligomers or functional polymers are deposited on a surface by methods comprising anodization.