This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

This application relates to a filtering mechanism and a device for producing a conductive material, where the filtering mechanism includes a filtering body, a cover, and a supporting member. The filtering body includes an accommodating cavity for accommodating an electroplating material and an opening provided on the filtering body; the cover is configured to cover the opening and connect to the filtering body to enclose the electroplating material in the filtering body; and the supporting member is provided on the cover to enhance connection strength between the cover and the filtering body.

An electrochemical deposition apparatus and method for the selective recovery of metal. The electrochemical deposition apparatus comprises a porous cathodic material, an anode, an inter-electrode region formed by the anode and cathode, and a gas release channel. The method may comprise passing a solution comprising a metal into a cavity, changing an oxidation state of a metal, and selectively depositing the metal onto a porous cathodic material. The electrochemical deposition apparatus may recover metal from metal feed in the form of metal hydroxides. The recovered metal may be from any source including, but not limited to, minerals, electronic waste, and black mass.

An electroplating apparatus includes: an electroplating bath including an anode region, in which an anode electrode is arranged, a cathode region and a membrane; a head unit including a contact ring holding a wafer and configured so that a first cathode potential is applied to the contact ring during an electroplating process; a reverse potential electrode arranged adjacent to the membrane and configured so that a second cathode potential is applied to the reverse potential electrode during the electroplating process, and a reverse cathode potential is applied to the reverse potential electrode during a rinsing process, and a power supply unit configured to apply the first cathode potential and the second cathode potential during the electroplating process, and further configured to apply the reverse cathode potential and a reverse anode potential to the anode electrode during the rinsing process.

One object of the present disclosure is to improve the accuracy of detection of an abnormality of various devices, and/or to advance the timing of detection of an abnormality. There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening; a motor configured to drive the opening adjustment member; and a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value.

A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.

A smart electrochemical processing apparatus includes a reaction container, an electrode unit and a surface feature scanner. The reaction container has an electrolytic tank. The electrode unit has a first electrode fixed to the electrolytic tank and a second electrode rotatably positioned at the electrolytic tank. The surface feature scanner is positioned at the electrolytic tank. Before being put in the electrolytic tank for processing, a workpiece positioned at the second electrode is scanned with the surface feature scanner while being rotated by the second electrode. After surface feature data of the workpiece have been collected, various process parameters can be adjusted to thereby achieve satisfactory surface treatment of the workpiece.

A smart electrochemical processing apparatus includes a reaction container, an electrode unit and a surface feature scanner. The reaction container has an electrolytic tank. The electrode unit has a first electrode fixed to the electrolytic tank and a second electrode rotatably positioned at the electrolytic tank. The surface feature scanner is positioned at the electrolytic tank. Before being put in the electrolytic tank for processing, a workpiece positioned at the second electrode is scanned with the surface feature scanner while being rotated by the second electrode. After surface feature data of the workpiece have been collected, various process parameters can be adjusted to thereby achieve satisfactory surface treatment of the workpiece.

Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.

A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.