An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.

The present invention refers to a method for determining the height of a foam blanket on an electroplating composition utilizing a radar signal, as well as a respective use.

The present invention refers to a method for determining the height of a foam blanket on an electroplating composition utilizing a radar signal, as well as a respective use.

The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in the catholyte chamber and the catholyte chamber is separated from the anolyte chamber by means of a membrane, wherein the membrane is tilted relative to the distribution body. The distribution body comprises jet openings for distributing a catholyte onto the substrate to be treated and drain openings for draining the catholyte out of a reaction space between the distribution body and the substrate. The catholyte outlet is arranged at the catholyte chamber in an eccentric position.

The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in the catholyte chamber and the catholyte chamber is separated from the anolyte chamber by means of a membrane, wherein the membrane is tilted relative to the distribution body. The distribution body comprises jet openings for distributing a catholyte onto the substrate to be treated and drain openings for draining the catholyte out of a reaction space between the distribution body and the substrate. The catholyte outlet is arranged at the catholyte chamber in an eccentric position.

The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.

The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.