The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

The present invention is directed toward an electrolyte which allows for electrolytically producing a black metal layer consisting of rhodium and ruthenium. The present invention also relates to a method for producing a corresponding article, and to the use of the electrolyte.

At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution.

At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.