Provided is a metal component that is configured to be used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; and a noble metal plating layer formed on all or part of a surface of the substrate, wherein the noble metal plating layer has a surface with irregularities, and a protrusion of the irregularities has an aspect ratio of 0.3 or more.

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D).

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In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.

Metastable alloys have recently emerged as high-performance catalysts, extending the toolbox of binary alloy materials that can be utilized to mediate electrocatalytic reactions. In particular, nanostructured metastable ordered intermetallic compounds are particularly challenging to synthesize. Here the present invention is directed to a method for synthesizing sub-15 nm metastable ordered intermetallic Pd31Bi12 nanoparticles at room temperature, in a single step, by pulsed electrochemical deposition onto high surface area carbon supports. The resulting Pd31Bi12 nanoparticles displays a 7× enhancement of the mass activity relative to Pt/C and a 4× enhancement relative to Pd/C for the oxygen reduction reaction (ORR). The high performance of Pd31Bi12 nanoparticles is demonstrated to arise from reduced oxygen binding caused by alloying of Pd with Bi. The isolation of Pd-sites from each other facilitate methanol tolerant ORR behavior.

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

A method for processing a smooth or structured surface of a pressing element is described, the method comprising the steps of: a) chrome-plating said surface of the pressing element so as to form a coating comprising a first layer having chrome grains oriented in a first direction and a second layer overlapping said first layer, said second layer having chrome grains oriented in a second direction which is different from said first direction; b) applying a mask on the chrome-plated surface of the pressing element by means of a digital printing technology; c) chemically treating the chrome-plated surface of the pressing element on which said mask was applied, said chemical treatment being performed so as to partially remove said chrome coating in the exposed areas of said chrome-plated surface, i.e. in the areas not being protected by said mask, and d) removing said mask from the chrome-plated surface of the pressing element, obtaining a smooth or structured surface having a coating with areas having a different grade of gloss and colour.

A pressing element obtained by the above processing method and a method for the production of coated panels, such as panels for furniture or floors, bearing a predetermined decorative pattern which uses such pressing element are also described.

Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non-nanotwinned copper layer by pretreating a surface of the non-nanotwinned copper layer with an oxidizing agent or other chemical reagent. Alternatively, nanotwinned copper may be electroplated to partially fill a recess in a dielectric layer, and non-nanotwinned copper may be electroplated over the nanotwinned copper to fill the recess. Copper overburden may be subsequently removed.

Disclosed herein are a surface-treated copper foil for a negative electrode current collector for secondary batteries, a method for producing the same, and a negative electrode for secondary batteries including the same. The surface-treated copper foil includes needle-shaped copper particles formed on at least one surface thereof, wherein the copper particles have an average major-axis length of about 0.6 μm to about 2.0 μm and are separated from one another by a distance of about 1 μm to about 5 μm.

A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 μm, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m.sup.3.

The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with negative charges; and a power supply which supplies a positive voltage for conducting the filter with positive charges and a negative voltage for the ionizer. The filter can be more simply manufactured at a lower cost than a conventional process.