Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.

A process for making a ribbon-shaped hollow thermal conductor includes forming a sacrificial material into an insert including a plurality of parallel strands. Plating the sacrificial insert with copper to form a ribbon-shaped structure and removing the sacrificial material from within the ribbon-shaped structure to create a hollow passage through a ribbon-shaped hollow copper thermal conductor.

A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 m.

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 m.

A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.