Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.

A combined oil control ring comprising a pair of annular side rails each having a gap, and an axially corrugated spacer expander arranged between the side rails; the corrugated spacer expander having on the inside seating tabs for pushing inner peripheral surfaces of the side rails; the side-rail-pushing surface of each seating tab being provided with a nitrided layer; an entire surface of each spacer expander except for those provided with the nitrided layer being coated with a plating film; and the plating film having Vickers hardness HV0.01 of 300 or less.

A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet, the method including disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through, and ejecting a gas through the slit gas nozzle toward the steel sheet.

An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.

Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.

A combined oil control ring comprising a pair of annular side rails each having a gap, and an axially corrugated spacer expander arranged between the side rails; the corrugated spacer expander having on the inside seating tabs for pushing inner peripheral surfaces of the side rails; the side-rail-pushing surface of each seating tab being provided with a nitrided layer; an entire surface of each spacer expander except for those provided with the nitrided layer being coated with a plating film; and the plating film having Vickers hardness HV0.01 of 300 or less.

A method for manufacturing an electroplated steel sheet by continuously performing electroplating on a steel sheet, the method including disposing a slit gas nozzle having an ejection port having a width wider than a width of the steel sheet in a width direction of the steel sheet on a side of an exit of an electroplating cell for the steel sheet to pass through, and ejecting a gas through the slit gas nozzle toward the steel sheet.

A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.