The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

A method of treating a material on a probe is provided. The method includes the steps of immersing a probe tip into a first fluid, wherein the probe tip includes one or more oxidized metallic fragments on a surface of the probe tip; polarizing the probe tip, through a counter electrode, with a negative current to reduce the one or more oxidized metallic fragments to one or more substantially unoxidized metallic fragments; removing the probe tip from the first fluid; immersing the probe in a second fluid, wherein the second fluid is a complexer for the one or more substantially unoxidized metallic fragments; and polarizing the probe tip with a positive current, through the counter electrode, wherein the positive current oxidizes the one or more substantially unoxidized metallic fragments.

A method of treating a material on a probe is provided. The method includes the steps of immersing a probe tip into a first fluid, wherein the probe tip includes one or more oxidized metallic fragments on a surface of the probe tip; polarizing the probe tip, through a counter electrode, with a negative current to reduce the one or more oxidized metallic fragments to one or more substantially unoxidized metallic fragments; removing the probe tip from the first fluid; immersing the probe in a second fluid, wherein the second fluid is a complexer for the one or more substantially unoxidized metallic fragments; and polarizing the probe tip with a positive current, through the counter electrode, wherein the positive current oxidizes the one or more substantially unoxidized metallic fragments.

Particles are removed from electronic components, such as components of data storage devices by use of an electrochemical process. An electronic component is immersed in an electrochemical bath, and a voltage is applied across the +ve electrode and ve electrode in an amount sufficient to remove charged particles present on a surface of the electronic component.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.