An electronic device according to various embodiments of the disclosure may include: a display; and a housing including the display, at least a portion of the housing including: an aluminum alloy machined to have a designated shape; a first film layer formed on the aluminum alloy; and a second film layer formed between the aluminum alloy and the first film layer, wherein the first film layer may be formed by a first anodizing process using a first voltage on the aluminum alloy, and the second film layer may be formed by a second anodizing process using a second voltage on the aluminum alloy after the first anodizing process.

The invention relates to an electrolyte for electropolishing metal surfaces, said electrolyte comprising methanesulphonic acid and additionally at least one phosphonic acid, as well as to an electropolishing method for same.

The invention relates to an electrolyte for electropolishing metal surfaces, said electrolyte comprising methanesulphonic acid and additionally at least one phosphonic acid, as well as to an electropolishing method for same.

A method of electropolishing an internal passageway of a component, wherein the passageway has an inlet and an outlet; including: providing an electrode assembly including a flexible electrode, a shuttle and a guide cable extending between the flexible electrode and the shuttle; inserting the shuttle into the inlet; causing fluid to flow through the passageway to transport the shuttle through the passageway from the inlet towards the outlet; pulling the guide cable through the passageway to position the electrode in the passageway adjacent to a region of the passageway to be polished; and electropolishing the passageway using the electrode while moving the electrode within the passageway. Also, an electrode assembly for electropolishing an internal passageway of a component, including: a flexible electrode, a shuttle, and a guide cable extending between the flexible electrode and the shuttle.

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.

The invention relates to a method for the electrochemical polishing of metal surfaces by means of repeating pulse sequences, wherein at least one anodic pulse is provided, the current intensity of which rises continuously in the time curve up to a specifiable value. The invention further relates to the use of said method for components produced in 3-D and to a system therefor.

The invention relates to a method for the electrochemical polishing of metal surfaces by means of repeating pulse sequences, wherein at least one anodic pulse is provided, the current intensity of which rises continuously in the time curve up to a specifiable value. The invention further relates to the use of said method for components produced in 3-D and to a system therefor.

The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

The present invention relates to a method for manufacturing an aluminum alloy anodized film having a superhydrophobic surface and an aluminum alloy having an anodized film with a superhydrophobic surface manufactured by the method. The present invention has an economical effect that an aluminum alloy, in which a three-dimensional shaped anodized film structure formed on the surface thereof is controlled in various forms, such as a pillar-on-pore structure, may be manufactured at low costs within a short time. The aluminum alloy with the controlled anodized film structure has excellent superhydrophobicity, corrosion resistance, and thermal conductivity, and thus may be used in various industrial fields, such as electronic device housings, LED lighting covers, heat exchangers, pipes, road structures, automobiles, aircrafts, ships, and generators.

The present invention relates to a method for manufacturing an aluminum alloy anodized film having a superhydrophobic surface and an aluminum alloy having an anodized film with a superhydrophobic surface manufactured by the method. The present invention has an economical effect that an aluminum alloy, in which a three-dimensional shaped anodized film structure formed on the surface thereof is controlled in various forms, such as a pillar-on-pore structure, may be manufactured at low costs within a short time. The aluminum alloy with the controlled anodized film structure has excellent superhydrophobicity, corrosion resistance, and thermal conductivity, and thus may be used in various industrial fields, such as electronic device housings, LED lighting covers, heat exchangers, pipes, road structures, automobiles, aircrafts, ships, and generators.