A compound strontium fluoroborate, nonlinear optical crystal of strontium fluoroborate, preparation method thereof; the chemical formula of the compound is SrB5O7F3, its molecular weight is 310.67, and it is prepared by solid-state reaction; the chemical formula of the crystal is SrB5O7F3, its molecular weight is 310.67, the crystal is of the orthorhombic series, the space group is Ccm21, and the crystal cell parameters are=10.016(6) Å, b=8.654(6)(4) Å, c=8.103(5) Å, Z=4, and V=702.4(8) Å3. A SrB5O7F3 nonlinear optical crystal has uses in the preparation of a harmonic light output when doubling, tripling, quadrupling, quintupling, or sextupling the frequency of a 1064-nm fundamental-frequency light outputted by a Nd:YAG laser, or the generation of a deep-ultraviolet frequency doubling light output lower than 200 nm, or in the preparation of a frequency multiplier, upper or lower frequency converter, or an optical parametric oscillator.

A compound strontium fluoroborate, nonlinear optical crystal of strontium fluoroborate, preparation method thereof; the chemical formula of the compound is SrB5O7F3, its molecular weight is 310.67, and it is prepared by solid-state reaction; the chemical formula of the crystal is SrB5O7F3, its molecular weight is 310.67, the crystal is of the orthorhombic series, the space group is Ccm21, and the crystal cell parameters are=10.016(6) Å, b=8.654(6)(4) Å, c=8.103(5) Å, Z=4, and V=702.4(8) Å3. A SrB5O7F3 nonlinear optical crystal has uses in the preparation of a harmonic light output when doubling, tripling, quadrupling, quintupling, or sextupling the frequency of a 1064-nm fundamental-frequency light outputted by a Nd:YAG laser, or the generation of a deep-ultraviolet frequency doubling light output lower than 200 nm, or in the preparation of a frequency multiplier, upper or lower frequency converter, or an optical parametric oscillator.

A furnace for electromagnetic casting a tubular-shaped silicon ingot is provided. The furnace includes a mold, outer and inner induction coils and a support member. The mold includes an outer crucible and an inner crucible. The outer crucible is annular-shaped. The inner crucible is disposed in the outer crucible and spaced away from the outer crucible to provide a gap between the inner crucible and the outer crucible. The mold is configured to receive granular silicon in the gap. The outer induction coil disposed around the outer crucible. The inner induction coil disposed in the inner crucible. The outer induction coil and the inner induction coil are configured to heat and melt the granular silicon in the mold to form a tubular-shaped silicon ingot. The support member is configured to hold and move a seed relative to the mold during formation of the tubular-shaped silicon ingot on the seed.

A single-crystal production equipment which includes, at least: a raw material supply apparatus which supplies a granular raw material to a melting apparatus positioned therebelow; the melting apparatus heats and melts the granular raw material to generate a raw material melt and supplies the raw material melt into a single-crystal production crucible positioned therebelow; and a crystallization apparatus which includes the single-crystal production crucible in which a seed single crystal is placed on the bottom, and a first infrared ray irradiation equipment which irradiates an infrared ray to the upper surface of the seed single crystal in the single-crystal production crucible, and the single-crystal production equipment is configured such that the raw material melt is dropped into a melt formed by irradiating the upper surface of the seed single crystal with the infrared ray, and a single crystal is allowed to precipitate out of the thus formed mixed melt.

A magnet structure includes columnar grains of rare earth permanent magnet phase aligned in a same direction and arranged to form bulk anisotropic rare earth alloy magnet having a boundary defined by opposite ends of the columnar grains and lacking triple junction regions, and rare earth alloy diffused onto opposite ends of the bulk anisotropic rare earth alloy magnet.

A method includes depositing a layer of alloy particles including rare earth permanent magnet phase above a substrate, laser scanning the layer while cooling the substrate to melt the particles, selectively initiate crystal nucleation, and promote columnar grain growth in a same direction as an easy axis of the rare earth permanent magnet phase. The method also includes repeating the depositing and scanning to form bulk anisotropic rare earth alloy magnet with aligned columnar grains.

A method for producing a piezoelectric single crystal ingot shows small variation in the concentration of PbTiO.sub.3 in the growth direction of single crystal. A complete solid solution-type piezoelectric single crystal ingot is produced by using the Bridgman method, including: filling a starting material, wherein a relaxor having a compositional formula Pb(B.sub.1, B.sub.2)O.sub.3 is blended with lead titanate having a composition PbTiO.sub.3 to give a preset composition, into a crucible for growth; heating to the melting temperature to give a melted liquid layer; then moving the crucible for growth toward the low temperature side; and thus starting one-direction solidification from the lower part of the crucible to thereby produce a single crystal. During solidification, the feedstock containing the relaxor and lead titanate having a maximum grain size ≤3 mm is continuously supplied into the crucible.

The invention discloses a device and a method for continuous VGF crystal growth through reverse injection synthesis, relating to a device for preparing a semiconductor crystal and growing a single crystal, in particular to a method and a device for continuously growing the crystal in situ by using a VGF method and reverse injection synthesis. The device includes a furnace body, a crucible, a heat preservation system, a heating system, a temperature control system and an gas pressure regulation system, wherein the crucible is arranged in the furnace body, has a synthesis unit at its upper part, and has a crystal growth unit and a seed crystal unit at its lower part, and the synthesis unit is communicated with the crystal growth unit through capillary pores. Red phosphorus and boron oxide are put into the growth unit, indium and boron oxide are put into the synthesis unit, solid seed crystals are put into the seed crystal unit, and temperature and pressure are controlled to accomplish material synthesis and in-situ crystal growth. According to the invention, the capillary pores are used, the temperature and the pressure are controlled, the phosphorus bubbles rise to the indium melt in the material synthesis stage, rendering a full fusion of the two substances, and after the phosphorus gasification, the indium-phosphorus melt drops into the growth unit to finish the in-situ growth of the crystal.

Produced is a large single crystal with no crystal grain boundary, which is a high-quality single crystal that has a uniform composition in both the vertical and horizontal directions at an optimum dopant concentration. Provided is a single-crystal production equipment including, at least: a granular raw material supply apparatus which supplies a certain amount of a granular raw material downward; a granular raw material melting apparatus which heats and melts the granular raw material and supplies the thus obtained raw material melt downward; and a crystallization apparatus which allows a single crystal to precipitate out of a mixed melt that is formed upon receiving a melt formed by irradiating an infrared ray from a first infrared ray irradiation equipment to the upper surface of a seed single crystal and the raw material melt supplied from the granular raw material melting apparatus.

A method for printing a semiconductor material includes depositing a molten metal onto a substrate in an enclosed chamber to form a trace having a maximum height of 15 micrometers and/or a maximum width of 25 micrometers to 10 millimeters and/or a thin film having a maximum height of 15 micrometers. The method further includes reacting the molten metal with a gas phase species in the enclosed chamber to form the semiconductor material. The depositing the molten metal includes depositing a metal composition including the molten metal and an etchant or depositing the etchant separate from the molten metal in the enclosed chamber.