Patent classifications
D03D1/0082
CUSHION MATERIAL FOR HOT PRESSING
There is provided a cushion material 10 for hot pressing including a cushion layer 1, wherein the cushion layer 1 includes woven fabric 5 and polyimide resin 6 adhered to surfaces of fibers forming the woven fabric 5 and has pores in the cushion layer 1, and warp and/or weft of the woven fabric 5 is texturized yarns made of glass fiber. This cushion material for hot pressing can maintain good cushioning properties even when used in high temperature pressing at 280° C. or more repeatedly.
METHOD FOR PREPARING LIQUID CRYSTAL POLYMER FILM, LIQUID CRYSTAL POLYMER FILM AND APPLICATION THEREOF
A method for preparing a liquid crystal polymer film, comprising: (1) spinning a liquid crystal polymer into fibers, and maintaining the fibers for 0.1 hour to 36 hours at a temperature of 200° C. to 400° C. under a vacuum degree less than 500 Pa for later use; (2) weaving the fibers prepared in step (1) into cloth for later use; and (3) pressing the cloth prepared in step (2) into a film at a temperature of 200° C. to 400° C., and then stretching the film to obtain the liquid crystal polymer film. The liquid crystal polymer film prepared by the preparation method is good in mechanical property, and has a tensile strength that can exceed 170 MPa. The prepared liquid crystal polymer film is applied to a FPC, which makes the FPC have a dielectric constant less than 3, and a small dielectric loss tangent angle.
CONDUCTIVE BASE MEMBER AND MULTILAYER CONDUCTIVE BASE MEMBER
To provide a flexible conductive base member and a multilayer conductive base member including the same, having no problem of failing to function as a contact and causing a variation in height between contacts.
There are a covered region 10 covered with a noble metal and a non-covered region 20 not circumferentially covered with a noble metal on a surface of a reticulated fibrous body 50. The covered region 10 is located at an intersection 7 of fibers 5 of the reticulated fibrous body 50, and the intersections 7 are connected to each other. The non-covered region 20 is located between the intersections 7 of the fibers 5 of the reticulated fibrous body 50.
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
Provided is a glass cloth obtained by weaving a glass thread, which is made from a plurality of glass filaments, as a warp and weft. The average filament diameter of the glass filaments is 3.0-4.5 μm. The respective weaving densities of the warp and the weft constituting the glass cloth are, independently, 70-130 threads/25 mm. The standard deviation of weft width of the glass cloth is not more than 30 μm. The weft covering ratio R, which is represented by the expression R=Y/(25400/D) (where R is the weft covering ratio, Y is the average weft width, and D is the well weaving density) satisfies the relational expression 0.50≤R≤0.83.
Method of glass fabric production including resin adhesion for printed circuit board formation
Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
Fabric control device
A fabric-based item may include a housing that is covered in fabric. Areas of the fabric may overlap input circuitry such as button switches, touch sensors, force sensors, proximity sensors, and other sensing circuitry and may overlap other components such as light-emitting components and haptic output devices. The fabric-based item may include control circuitry that gathers user input from the input circuitry and wireless communications circuitry that the control circuitry uses to transmit remote control commands and other wireless signals in response information from the input circuitry. The fabric-based item may have a weight that is located in the housing to orient the housing in a desired direction when the housing rests on a surface. A movable weight may tilt the housing in response to proximity sensor signals or other input. Portions of the fabric may overlap light-emitting components and optical fiber configured to emit light.
LOW DIELECTRIC RESIN SUBSTRATE
The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.
ANNEALED QUARTZ GLASS CLOTH AND METHOD FOR MANUFACTURING SAME
The present invention is an annealed quartz glass cloth that has an SiO.sub.2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m.sup.2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.
Fabric Control Device
A fabric-based item may include a housing that is covered in fabric. Areas of the fabric may overlap input circuitry such as button switches, touch sensors, force sensors, proximity sensors, and other sensing circuitry and may overlap other components such as light-emitting components and haptic output devices. The fabric-based item may include control circuitry that gathers user input from the input circuitry and wireless communications circuitry that the control circuitry uses to transmit remote control commands and other wireless signals in response information from the input circuitry. The fabric-based item may have a weight that is located in the housing to orient the housing in a desired direction when the housing rests on a surface. A movable weight may tilt the housing in response to proximity sensor signals or other input. Portions of the fabric may overlap light-emitting components and optical fiber configured to emit light.