There is provided a cladding member (13) formed of a supporting body portion (67) having mounts (54) and a head portion (12), and an absorber surface portion (70) having a peripheral boundary wall (71) defining a recess into which a solar cell array (removed in this view for clarity) is bonded. The supporting (67) and absorber surface (70) body portions are pressure moulded from polyvinyl ester/glassfibre (30%)/fire retardant (40%)/pigment sheet moulding compound. Complementary bonding portions (72) form a glue line in assembly and have complementary water passages (73) defined therebetween. The bonding portions (72) contrive a generally sinusoidal glue space (74) that is longer that the transverse sectional dimension of the boding portions (72), cooperating with the adhesive system to resist water pressure in the passages (73).

A shingle support according to this invention is easily aligned on and affixed to roof rafters. Once affixed, the shingle support provides a support to roofing shingles, to facilitate installation. It also provides the function of creating a protective terminus to each shingle to prevent lifting and damage by wind. As a result of use of the shingle support according to this invention, roofers are provided with an apparatus, kit, system and method for roof shingle installation superior to that currently available. In addition, the resulting roof shingle installation is more robust than known roof shingle installations.

The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.

There is provided a cladding member (13) formed of a supporting body portion (67) having mounts (54) and a head portion (12), and an absorber surface portion (70) having a peripheral boundary wall (71) defining a recess into which a solar cell array (removed in this view for clarity) is bonded. The supporting (67) and absorber surface (70) body portions are pressure moulded from polyvinyl ester/glassfibre (30%)/fire retardant (40%)/pigment sheet moulding compound. Complementary bonding portions (72) form a glue line in assembly and have complementary water passages (73) defined therebetween. The bonding portions (72) contrive a generally sinusoidal glue space (74) that is longer that the transverse sectional dimension of the boding portions (72), cooperating with the adhesive system to resist water pressure in the passages (73).

The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.

The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.

A ridge structure at a roof edge, having a base panel lying on a roof surface and a hollow ridge structure over the base panel. The hollow ridge structure is constructed in a flat spring form along the eaves, and therefore one slope of the ridge faces the roof and the other slope the opposite direction. The slope facing the roof can be lifted to receive and secure roofing materials between the slope and the base panel. When water flows down the roof surface, most water flows over the ridge structure and the rest flows into the hollow space inside the ridge structure and drains through drain holes on the base panel.

A ridge structure at a roof edge, having a base panel lying on a roof surface and a hollow ridge structure over the base panel. The hollow ridge structure is constructed in a flat spring form along the eaves, and therefore one slope of the ridge faces the roof and the other slope the opposite direction. The slope facing the roof can be lifted to receive and secure roofing materials between the slope and the base panel. When water flows down the roof surface, most water flows over the ridge structure and the rest flows into the hollow space inside the ridge structure and drains through drain holes on the base panel.