A fire-rated flooring panel for use in forming a suspended floor, comprising: a bottom metal sheet layer; an upper re-enforced concrete layer overlaying the bottom layer; and a structural steel frame enclosing circumferential walls of the upper and lower layers.

An antenna floor tile for a raised floor system comprises a frame; an insert supported by the frame, the insert including a top surface; a recess disposed below the top surface; an antenna attached to the insert within the recess; and a protective layer disposed over the antenna.

A heating system comprises: a structure forming an elevated floor above a slab and supported by legs; and heating panels comprising an upper panel having downwardly formed outer walls and downwardly protruding structure-seating parts on parts inside the corners capable of taking the load so that the upper panel can be fixed above the structure, and a lower panel having an upwardly bent body to attach to the bottom of the upper panel, the heating means installed in the interior, and the penetration parts which the structure-seating parts penetrate, wherein when the upper panel and lower panel are attached, the empty space therebetween is filled with cement mortar or red clay and cured.

A floor system uses interlocking elements to form a surface raised above a floor surface for the distribution of electrical power and data throughout the floor of a building. The base units of the interlocking elements define channels which receive cables for data and power transmission. Channel and corner covers overlie the channels and interlock with the base units to form the raised surface. Fused electrical feed modules within channels provide electrical power to bus bars which distribute the power to fused terminal boxes and radio frequency sensors and beacons mounted in the base units.

The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.

A floor system uses interlocking elements to form a surface raised above a floor surface for the distribution of electrical power and data throughout the floor of a building. The base units of the interlocking elements define channels which receive cables for data and power transmission. Channel and corner covers overlie the channels and interlock with the base units to form the raised surface. Fused electrical feed modules within channels provide electrical power to bus bars which distribute the power to fused terminal boxes and radio frequency sensors and beacons mounted in the base units.

A floor system uses interlocking elements to form a surface raised above a floor surface for the distribution of electrical power and data throughout the floor of a building. The base units of the interlocking elements define channels which receive cables for data and power transmission. Channel and corner covers overlie the channels and interlock with the base units to form the raised surface. Fused electrical feed modules within channels provide electrical power to bus bars which distribute the power to fused terminal boxes and radio frequency sensors and beacons mounted in the base units.

A floor system uses interlocking elements to form a surface raised above a floor surface for the distribution of electrical power and data throughout the floor of a building. The base units of the interlocking elements define channels which receive cables for data and power transmission. Channel and corner covers overlie the channels and interlock with the base units to form the raised surface. Fused electrical feed modules within channels provide electrical power to bus bars which distribute the power to fused terminal boxes and radio frequency sensors and beacons mounted in the base units.

The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.