Patent classifications
F04F9/04
Diffusion pump to supply heat from a condenser to a heating element
A diffusion pump is provided that includes a housing and a boiling chamber connected to the housing. The boiling chamber has a heating element. The housing has a nozzle that is connected to the boiling chamber. The housing also has a condenser is arranged at an internal surface, where the condenser has a cooling system. The boiling chamber is thermally isolated from the condenser by an isolator. The cooling system is at least partially a water cooling system and is connected to the heating element via a heat pump such that heat from the condenser is supplied to the heating element.
Diffusion pump to supply heat from a condenser to a heating element
A diffusion pump is provided that includes a housing and a boiling chamber connected to the housing. The boiling chamber has a heating element. The housing has a nozzle that is connected to the boiling chamber. The housing also has a condenser is arranged at an internal surface, where the condenser has a cooling system. The boiling chamber is thermally isolated from the condenser by an isolator. The cooling system is at least partially a water cooling system and is connected to the heating element via a heat pump such that heat from the condenser is supplied to the heating element.
DIFFUSION PUMP
A diffusion pump, in particular an energy-efficient diffusion pump comprising a housing and a boiling chamber connected to the housing. In the area of the boiling chamber a heating element is arranged. Further, a nozzle is arranged in the housing which nozzle is connected to the boiling chamber. In the area of the nozzle a condenser is arranged at an internal surface of the housing, wherein in the area of the condenser a cooling system for cooling the condenser is provided. The boiling chamber is thermally isolated from the condenser by an isolator. Alternatively or additionally, the cooling system of the condenser is at least partially a water cooling system. Alternatively or additionally, the cooling system of the condenser is connected to the heating element via a heat pump such that heat from the condenser is supplied to the heating element. Alternatively or additionally, a temperature measuring device is provided which measures the condenser temperature, wherein the temperature measuring device is connected to a condenser cooling system regulator for regulating the cooling system of the condenser. Alternatively or additionally, the heating element has connected thereto a heating element regulator for adjusting the heat output of the heating element to the prevailing pumping situation.