The present application describes making a resilient pad composite.

A shock absorber has a first and second end surfaces opposite to each other in an axial direction, and a plurality of connection surfaces. The first end surface is an N-sided polygon (N is an integer of 3 or more and the second end surface is an M-sided polygon (M is an integer of 4 or more and more than N). (M−N) vertices are provided at intermediate positions in the axial direction on a circumferential surface defined by the plurality of connection surfaces. From the vertices, one first ridgeline reaches one vertex of the first end surface and two second ridgelines reach a corresponding one of two vertices of the second end surface. The remaining vertices are connected to each other by (2×N−M) third ridgelines. The first ridgeline, the second ridgelines, and the third ridgelines define the plurality of connection surfaces.

The invention relates to a vibration damper for connecting two devices to one another, in particular an engine to an environment (100) of the engine, for example a car body, wherein the vibration damper includes a damping section (20) and a fastening section (10), wherein the mounting portion (10) is formed with first and second pipe socket portions (14) having a flange (12), and wherein the damping portion (20) at least partially surrounds the fastening portion (10) at the outer surface thereof.

There is described an aircraft configured to be able to hover, comprising a fuselage; and a support element adapted to support a load, made of elastically deformable material and constrained to said fuselage; the support element being movable in an operating position in which it is arranged at least partially outside said fuselage and supports said load; the aircraft comprises a sock surrounding the support element arranged in said operating position; the sock is configured to contain the elastic return of the support element, in case the support element arranged in said operating position is sheared off.

A shock absorber includes a shock absorbing portion having a three-dimensional shape formed by a wall in which an outer shape is defined by a pair of parallel curved surfaces. The shock absorbing portion includes at least one three-dimensional structure body obtained by changing a shape of a unit structure body thickened based on a unit structure of a Schwartz P structure. The shape of the three-dimensional structure body in an unloaded state is a shape obtained by changing the shape of the unit structure so as to follow the shape change of the unit structure body, which is the regular hexahedron shaped space occupied by the unit structure body, into the trapezoidal space.

A vibration dampening device, a mounting assembly including a vibration dampening device, and a method of dampening vibration in a vibration-sensitive component using the same. The vibration dampening device includes a first member that rests upon or is operatively engaged with a support surface; a second member that is operatively engaged with the vibration-sensitive component; and at least one isolator assembly interposed between the first member and the second member, wherein the first member and the second member are decoupled from one another by the at least one isolator assembly. The at least one isolator assembly includes a first isolator that is at least partially embedded in the first member and a second isolator that is at least partially embedded in the second member, and an isolator insert that extends between the first isolator and second isolator. The isolator insert creates a gap between the first and second members.

A drive assembly for a motor vehicle includes a drive, a transmission that can be driven by the drive, a drive housing, a transmission housing, and a fastening device. The drive is arranged in the drive housing, and the transmission is arranged in the transmission housing. The drive housing or the transmission housing can be fastened on a carrier by way of the fastening device. The fastening device includes a plurality of vibration dampers and sleeve elements. The sleeve elements surround the vibration dampers.

A wave spring unit comprising a plurality of annular wave-spring elements stacked vertically along an axial direction, which is characterized in that each of the annular wave spring elements of the wave spring unit comprises crest portion and trough portion formed alternately in a horizontal axial direction; said crest portion and trough portion of adjacent vertically annular wave spring elements are positioned opposite each other; said adjacent vertically annular wave spring elements have the same or different from each other in at least one physical parameter selected form a strip thickness, a strip diameter, a strip weight, strip shape, wave contact number, edge shape, overall shape of the spring and a combination of wave and helical spring; and the wave spring unit has a maximum compression up to 30.2 mm and is capable of bearing load up to 2680.2 N.

An elastic articulation comprising a first sleeve and a second sleeve is provided. The first sleeve and the second sleeve each include a respective outer armature, a respective inner armature, and a respective elastic body between their respective outer and inner armatures. The elastic articulation also comprises a ring longitudinally connecting the first sleeve and the second sleeve. The ring forms a radial stop between the inner armature and the outer armature of the first sleeve, and between the inner armature and the outer armature of the second sleeve. The elastic articulation improves damping control in different directions.

Wafer cushions for use in wafer carriers include spring beams that include a first arm extending from the frame of the wafer cushion in a first direction and a second arm extending from the first arm in a second direction, and a wafer contact at the end of the second arm opposite where the second arm is joined to the first arm. The wafer cushion may contact a substrate within the wafer carrier only at the wafer contacts during normal conditions. The substrate may also contact secondary contact points on the second arm when a shock event occurs. The wafer contact can be v-groove style wafer contact. The wafer contact may include a contact surface having a convex surface where it is configured to contact the wafer.