A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

A coupling for vacuum-insulated piping is disclosed having first and second parts for forming the coupling; each of the first and second parts comprising an inner portion for fluid communication with an inner part of a vacuum-insulated pipe and an outer portion for fluid communication with an outer, low pressure part of a vacuum-insulated pipe; the inner portions of the first and second parts form an inner region for the passage of fluid therethrough; each of the first and second parts comprising an interface portion for forming an interface with interface portion of the other of the first and second parts, the interface portion comprising a flange for connecting the first and second parts; each of the first and second parts comprises a sleeve surrounding the outer portion, the sleeve comprising a thermally-conducting portion that is in thermal communication with the interface portion so as to conduct heat away from the interface portion.

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

A vacuum insulator having a structure that improves thermal insulation performance, a method of manufacturing the vacuum insulator, and a refrigerator including the vacuum insulator are provided. The refrigerator includes an outer case configured to form an external appearance, an inner case provided inside the outer case and forming a storage compartment and a vacuum insulator provided between the outer case and the inner case. The vacuum insulator includes a core material formed of glass fibers having a diameter larger than or equal to 5 μm and smaller than or equal 8 μm, an adsorbent configured to adsorb a heat transfer medium, and an envelope configured to accommodate the core material and the adsorbent.

A vacuum insulator having a structure that improves thermal insulation performance, a method of manufacturing the vacuum insulator, and a refrigerator including the vacuum insulator are provided. The refrigerator includes an outer case configured to form an external appearance, an inner case provided inside the outer case and forming a storage compartment and a vacuum insulator provided between the outer case and the inner case. The vacuum insulator includes a core material formed of glass fibers having a diameter larger than or equal to 5 μm and smaller than or equal 8 μm, an adsorbent configured to adsorb a heat transfer medium, and an envelope configured to accommodate the core material and the adsorbent.

An apparatus includes a Polymer Thermal Expansion Based Passive Thermal Diode (PTE-PTD) that includes layers and is configured to provide passive heating and cooling of a pipeline. A polyurethane (PU) layer is provided that is configured to contact at least an upper portion along a length of a pipe. A polyethylene terephthalate (PET) layer is provided that is configured to surround the PU layer and the length of the pipe. A graphene layer is provided that is configured to surround an epoxy layer. An epoxy shell is provided that is configured to surround the graphene layer. An air gap on a first side of the PTE-PTD is provided. The air gap is formed by a void in the PET layer and is configured to provide additional air space between the PET layer and the PU layer. The air gap provides an upward movement of the PET layer using opposite forces of alternate sides of the PET layer. The PTE-PTD is installed on the pipeline.

An apparatus includes a Polymer Thermal Expansion Based Passive Thermal Diode (PTE-PTD) that includes layers and is configured to provide passive heating and cooling of a pipeline. A polyurethane (PU) layer is provided that is configured to contact at least an upper portion along a length of a pipe. A polyethylene terephthalate (PET) layer is provided that is configured to surround the PU layer and the length of the pipe. A graphene layer is provided that is configured to surround an epoxy layer. An epoxy shell is provided that is configured to surround the graphene layer. An air gap on a first side of the PTE-PTD is provided. The air gap is formed by a void in the PET layer and is configured to provide additional air space between the PET layer and the PU layer. The air gap provides an upward movement of the PET layer using opposite forces of alternate sides of the PET layer. The PTE-PTD is installed on the pipeline.

A vacuum heat-insulating material includes: an outer cover material; and a core material which is sealed in a tightly closed and decompressed state on the inside of the outer cover material. Outer cover material has gas barrier properties and satisfies at least one of a condition that a linear expansion coefficient is 80×10.sup.−5/° C. or lower when a static load is 0.05 N within a temperature range of −130° C. to 80° C., inclusive, a condition that an average value of a linear expansion coefficient is 65×10.sup.−5/° C. or higher when a static load is 0.4 N within a temperature range of −140° C. to −130° C., inclusive, a condition that an average value of a linear expansion coefficient is 20×10.sup.−5/° C. or higher when a static load is 0.4 N within a temperature range of −140° C. to −110° C., inclusive, and a condition that an average value of a linear expansion coefficient is 13×10.sup.−5/° C. or higher when a static load is 0.4 N within a temperature range of +50° C. to +65° C., inclusive.