A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.

The present disclosure provides a light-emitting diode (LED) lighting device. The LED lighting device includes a lamp base, a glass shell, a heat-dissipating cup, a driving power source, an LED light source module, and an optical portion. The LED light source module, the heat-dissipating cup, and the driving power source are arranged from top to bottom inside the glass shell. A top portion of the glass shell is connected to the optical portion and a bottom portion of the glass shell is connected to the lamp base. The heat-dissipating cup faces upwardly and an outer sidewall of the heat-dissipating cup forms a close contact with an inner sidewall of the glass shell. The LED light source module is fixed within the heat-dissipating cup. The driving power source is positioned under the heat-dissipating cup and a space is formed between the driving power source and the heat-dissipating cup.

The present invention discloses a lamp structure. An accommodating cavity is provided for disposing a lamp board. An insulating unit seals the opening of the accommodating cavity for preventing accidental electric shocks when a user cleans or maintains the lamp structure. Placing the lamp board inside the accommodating cavity, the space occupied by the lamp board on the base may be saved. The insulating unit may prevent foreign matters or water from contacting the lamp board and resulting in short circuit or failure in the lamp board. One or more heat dissipating unit may be disposed in the accommodating cavity and used as the heat dissipating structure for the lamp board. A recess may be disposed on an inner side of the accommodating cavity. The recess communicates with the accommodating cavity. A capacitor may be disposed in the recess and connected electrically to the lamp board.

Disclosed is a lamp, including a lamp body in a trough shape, a light source assembly, and a heat dissipation assembly; where, the heat dissipation assembly includes an aluminum plate, a heat dissipation fin and a glass radiator; the aluminum plate is disposed on a trough wall of the lamp body; the heat dissipation fin is disposed on a side of the aluminum plate; the glass radiator is disposed on a side of the aluminum plate; the light source assembly includes a PCB board and a plurality of LED lamp beads; the PCB board is disposed on a side of the glass radiator; and the plurality of LED lamp beads are arranged on a side of the PCB board forming a light emitting surface.

An LED module includes a light emitting part, a board part electrically connected to the light emitting part, and a heat radiating part disposed on a lower side of the light emitting part and the board part, and a surface treatment is applied to the heat radiating part.

An annular LED grow light is disclosed, which comprises a radiator, a light source board, and a power supply box. The light source board is composed of a PCB light board and a plurality of LED lamp beads, wherein the LED lamp beads are arranged on the PCB light board in an annular array about a center. The beneficial effects of the present disclosure are: the photosynthetic photon flux density (PPFD) is distributed more evenly after the LED lamp beads are arranged in an annular array about the center, thus the effective irradiated area is larger, and the cost has been saved.

An annular LED grow light is disclosed, which comprises a radiator, a light source board, and a power supply box. The light source board is composed of a PCB light board and a plurality of LED lamp beads, wherein the LED lamp beads are arranged on the PCB light board in an annular array about a center. The beneficial effects of the present disclosure are: the photosynthetic photon flux density (PPFD) is distributed more evenly after the LED lamp beads are arranged in an annular array about the center, thus the effective irradiated area is larger, and the cost has been saved.

A lighting device, such as a replacement lighting device, comprising a light source (LS), e.g. LEDs, for producing light along an optical axis (OA). A heat sink (HS) made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink being a part of the housing, transports heat away from the light source (LS). A Radio Frequency (RF) communication circuit (CC) connected to an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can be obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the heat sink (HS).

A lighting device, such as a replacement lighting device, comprising a light source (LS), e.g. LEDs, for producing light along an optical axis (OA). A heat sink (HS) made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink being a part of the housing, transports heat away from the light source (LS). A Radio Frequency (RF) communication circuit (CC) connected to an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can be obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the heat sink (HS).

Described herein is an illuminating device with reflector. Said device includes a heat sink insert moulded cylindrical plastic housing, and a circular metal core printed circuit board, MCPCB, mounted on a circular slot provided on a top inner end of the housing, the circular MCPCB having light emitting diodes (LEDs), wherein LEDs mounted in a circular manner near peripheral region of a top surface of the MCPCB and having electronic components mounted in a central region of the top surface of the MCPCB. Further said device includes a cylindrical reflector fixed on the top surface of the MCPCB with its cylindrical wall lying between the LEDs and the electronic components; and a diffuser connecting a top surface of the cylindrical reflector with the top inner end of the housing, wherein lower end of said plastic housing connected with a holder.