Disclosed are implementations for minimizing substrate contamination during pressure changes in substrate processing systems. Over a duration of a pressure change (increase or decrease) in a chamber of a substrate processing system, a flow rate is adjusted multiple times to reduce occurrence of contaminant particles in an environment of the chamber. In some instances, the flow rate is changed continuously using at least one dynamic valve that enable continuous control over the pressure dynamics of the chamber.

Disclosed are implementations for minimizing substrate contamination during pressure changes in substrate processing systems. Over a duration of a pressure change (increase or decrease) in a chamber of a substrate processing system, a flow rate is adjusted multiple times to reduce occurrence of contaminant particles in an environment of the chamber. In some instances, the flow rate is changed continuously using at least one dynamic valve that enable continuous control over the pressure dynamics of the chamber.

There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.

There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.

A laminar flow diffuser with integrated lighting has a frame for supporting an air plenum and a lower housing. The air plenum receives conditioned air from a source of conditioned. The lower housing is attached to the bottom of the plenum. An aperture plate damper installed below the top plenum regulates the flow of air from the plenum through the laminar flow diffuser. A clear or translucent engineered, fire rated polymer perforated diffuser face forms the outlet from the lower housing to the room below. LED strips are positioned around the inside periphery of the lower housing. A light guide is installed adjacent the LED lighting strips to spread the light across the area of the perforated diffuser face.

A system for monitoring FFUs in each of clean rooms includes a first exhaust fan disposed above the clean rooms; lines each having one end connected to the FFUs in each clean room and the other end connected to a gateway; a personal computer communicating with the gateway; gas removal units disposed under the clean rooms and connected to a second exhaust fan; an emergency damper connected to the second exhaust fan; a CO.sub.2 cylinders room disposed besides the emergency damper; and gas detectors, each communicating with the FFUs via the line, each gas detector having a connector connected to the gateway.

A dynamic air supply system for controlling ventilation in a clean room, wherein the clean room comprises a clean area subject to contamination, comprising a radiant panel arranged within a ceiling above the clean area, a first air supply diffuser and a second air supply diffuser arranged within the ceiling, a controller coupled with the air supply diffusers for controlling the air supply. The first air supply diffuser and the second air supply diffuser are arranged on opposite sides of the radiant panel. The first air supply diffuser and the second air supply diffuser are arranged to diffuse air flows along the radiant panel and towards clean area. The controller is configured to change the air supply diffusers between nursing mode and normal mode, wherein the supply air volume in normal mode is 10%-65% of the supply air volume in nursing mode.

A dynamic air supply system for controlling ventilation in a clean room, wherein the clean room comprises a clean area subject to contamination, comprising a radiant panel arranged within a ceiling above the clean area, a first air supply diffuser and a second air supply diffuser arranged within the ceiling, a controller coupled with the air supply diffusers for controlling the air supply. The first air supply diffuser and the second air supply diffuser are arranged on opposite sides of the radiant panel. The first air supply diffuser and the second air supply diffuser are arranged to diffuse air flows along the radiant panel and towards clean area. The controller is configured to change the air supply diffusers between nursing mode and normal mode, wherein the supply air volume in normal mode is 10%-65% of the supply air volume in nursing mode.

An air treatment device includes: a treater configured to capture a toxic substance contained in target air; a regenerator configured to remove the toxic substance from the treater; a detector configured to detect an index correlated with a concentration of the toxic substance contained in room air; and a control unit configured to control the regenerator according to a detection value detected by the detector.

Disclosed is a method of filtering air in a closed work environment that includes placing a primary air filter assembly in the closed work environment, where the primary air filter assembly includes a first air input and a first air output. The first air output is poised to emit once-filtered air outside the closed work environment. The method also includes placing a secondary air filter assembly in the closed work environment, where the secondary air filter assembly includes a second air input and a second air output.