The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

An integrated valve includes a connecting member including a first valve element and a second valve element. The first valve element is disposed in a pressure reducing chamber of a body of the integrated valve and forms a pressure reducing valve that reduces the pressure of the refrigerant discharged from a compressor. The second valve element is disposed in an on-off valve chamber of the body and forms an on-off valve for adjusting a flow rate of the refrigerant flowing into an intermediate-pressure port of the compressor. The on-off valve is in a fully opened state when the pressure reducing valve is in a throttling state, the on-off valve is in an opened state when the pressure reducing valve is in an opened state, and the on-off valve is in a closed state when the pressure reducing valve is in a fully opened state.

A refrigeration system configured to receive a refrigerant is provided, as well as a walk-in refrigeration unit configured to utilize said system. The refrigeration system comprises: a power source, a condenser unit, an evaporation unit, a plurality of compressors, wherein each of the plurality of compressors is communicably coupled to the condenser unit, and a plurality of expansion devices, wherein each of the plurality of expansion devices is communicably coupled to the evaporation unit. The system is configured to receive an A3 refrigerant having a Global Warming Potential (GWP) value less than 10.

The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

A heat management apparatus comprises a first heat exchange portion, a second heat exchange portion and a throttle unit, wherein the first heat exchange portion is used for exchanging heat between a refrigerant throttled by the throttle unit, and a cooling liquid; and a first wall of the first heat exchange portion and a second wall of the second heat exchange portion are arranged opposite each other, such that the structure of the heat management apparatus is relatively compact.

A refrigerant pipe unit includes: a first plate; a second plate stacked on the first plate; and a control valve. One or both of the first plate and the second plate include a refrigerant flow path. The control valve includes: a valve body that includes a refrigerant passage communicating with the refrigerant flow path, rotates in the first plate, and changes a flow of a refrigerant in the refrigerant flow path with an amount of rotation of the valve body; and a driver that adjusts the amount of the rotation of the valve body.

A thermal management system is described. The thermal management system includes a receiver configured to store a refrigerant, the receiver having a receiver inlet and a receiver outlet, a closed-circuit refrigeration system including a vapor compression closed-circuit system that includes the receiver, and a closed-circuit system that includes the receiver, wherein the closed-circuit refrigeration system is configurable to receive refrigerant from the receiver through one or both of the vapor compression closed-circuit system and the closed-circuit system.

A heat pump includes a refrigerant loop. The refrigerant loop includes a compressor, a first condenser, a vapor generator having a first region and a second region, a first expansion valve, a second expansion valve, and a first evaporator. A branching point is positioned between the first condenser and the vapor generator. The branching point diverts a portion of a first heat exchange fluid circulating through the refrigerant loop to the vapor generator. The first expansion valve is positioned between the branching point and the vapor generator. An outlet vapor generator is coupled to a mid-pressure inlet port of the compressor.

A device for controlling a flow rate and expanding a fluid in a fluid circuit. The device is formed with an enclosure and a valve element arranged inside the enclosure. The valve element which is arranged movably in a linear movement in the direction of a longitudinal axis relative to the enclosure has a sealing surface and a control area formed at a first end face of the valve element and arranged adjacent to the sealing surface in the axial direction. The sealing surface is formed as a lateral surface of a straight circular cylinder with a constant outer diameter. An outer diameter of a surface of the control area corresponds to the outer diameter of the sealing surface. The control area has throughflow apertures and at least one control aperture. The valve element in the control area is formed with a substantially hollow circular cylindrical-shaped wall.

The invention relates to an adsorption refrigerator or an adsorption heat pump as well as a method for the operation thereof. The adsorption refrigerator or adsorption heat pump comprises at least one module having an adsorber, a mixing evaporator and a mixing condenser. It is characterized in that the adsorber together with the mixing evaporator and the mixing condenser within the module is structurally combined and contained within a common, preferably thermally insulated adsorber container for accommodating the adsorber and having an adsorber section which can be thermally contacted externally, and having a mixing section thermally insulated externally for accommodating the mixing evaporator and the mixing condenser, wherein the mixing section is formed so that a refrigerant can flow through it, so that the refrigerant, after having flown through the mixing section, can be supplied to an external heat exchanger that is separated from the module, wherein the mixing section is arranged to enable the refrigerant to be evaporated and/or condensed.