A furnace system includes a pre-heating zone disposed on a conveyer device, a furnace facility located behind the pre-heating zone and having a gas heating zone and an electrical heating zone for heating the work piece to the required or predetermined temperature, and a cooling zone for lowering the work piece to a room temperature, the furnace facility includes a heat recycling device connected to the cooling zone and the heating zone, and connected to the pre-heating zone, for collecting a heat energy in the cooling zone and in the heating zone and for supplying the collected heat energy to the pre-heating zone for pre-heating the work piece and for saving the energy.

A furnace system includes a pre-heating zone disposed on a conveyer device, a furnace facility located behind the pre-heating zone and having a gas heating zone and an electrical heating zone for heating the work piece to the required or predetermined temperature, and a cooling zone for lowering the work piece to a room temperature, the furnace facility includes a heat recycling device connected to the cooling zone and the heating zone, and connected to the pre-heating zone, for collecting a heat energy in the cooling zone and in the heating zone and for supplying the collected heat energy to the pre-heating zone for pre-heating the work piece and for saving the energy.

A rapid thermal processing method and a rapid thermal processing device are provided. The rapid thermal processing method includes the following operations. A wafer is provided. A first heating operation is performed on the wafer to heat the wafer to a first temperature. The wafer is controlled to start rotating. The first temperature is maintained for a first predetermined time. A second heating operation is performed on the wafer to heat the wafer from the first temperature to a second temperature, and the second temperature is maintained for a second predetermined time. A third heating operation is performed on the wafer to heat the wafer from the second temperature to a third temperature, and the third temperature is maintained for a third predetermined time.

A rapid thermal processing method and a rapid thermal processing device are provided. The rapid thermal processing method includes the following operations. A wafer is provided. A first heating operation is performed on the wafer to heat the wafer to a first temperature. The wafer is controlled to start rotating. The first temperature is maintained for a first predetermined time. A second heating operation is performed on the wafer to heat the wafer from the first temperature to a second temperature, and the second temperature is maintained for a second predetermined time. A third heating operation is performed on the wafer to heat the wafer from the second temperature to a third temperature, and the third temperature is maintained for a third predetermined time.

A furnace working system includes a vacuumed pre-heating zone, a vacuumed gas heating zone disposed behind the pre-heating zone, a vacuumed electric heating zone, a high cooling zone disposed behind the electric heating zone, a low cooling zone disposed behind the high cooling zone, a conveyer disposed in the zones for transporting a work piece through the zones, a pipe couples the high cooling zone to the gas heating zone for supplying a heat from the high cooling zone to the gas heating zone, and a conduit couples the low cooling zone to the pre-heating zone for supplying a heat from the low cooling zone to the pre-heating zone. A transition zone is disposed between the gas heating zone and the electric heating zone.

A furnace working system includes a vacuumed pre-heating zone, a vacuumed gas heating zone disposed behind the pre-heating zone, a vacuumed electric heating zone, a high cooling zone disposed behind the electric heating zone, a low cooling zone disposed behind the high cooling zone, a conveyer disposed in the zones for transporting a work piece through the zones, a pipe couples the high cooling zone to the gas heating zone for supplying a heat from the high cooling zone to the gas heating zone, and a conduit couples the low cooling zone to the pre-heating zone for supplying a heat from the low cooling zone to the pre-heating zone. A transition zone is disposed between the gas heating zone and the electric heating zone.

A furnace working system includes a vacuumed pre-heating zone, a vacuumed gas heating zone disposed behind the pre-heating zone, a vacuumed electric heating zone, a high cooling zone disposed behind the electric heating zone, a low cooling zone disposed behind the high cooling zone, a conveyer disposed in the zones for transporting a work piece through the zones, a pipe couples the high cooling zone to the gas heating zone for supplying a heat from the high cooling zone to the gas heating zone, and a conduit couples the low cooling zone to the pre-heating zone for supplying a heat from the low cooling zone to the pre-heating zone. A transition zone is disposed between the gas heating zone and the electric heating zone.

A furnace working system includes a vacuumed pre-heating zone, a vacuumed gas heating zone disposed behind the pre-heating zone, a vacuumed electric heating zone, a high cooling zone disposed behind the electric heating zone, a low cooling zone disposed behind the high cooling zone, a conveyer disposed in the zones for transporting a work piece through the zones, a pipe couples the high cooling zone to the gas heating zone for supplying a heat from the high cooling zone to the gas heating zone, and a conduit couples the low cooling zone to the pre-heating zone for supplying a heat from the low cooling zone to the pre-heating zone. A transition zone is disposed between the gas heating zone and the electric heating zone.

A heat treatment system includes heating chambers configured to perform heat treatment on objects to be treated, and a conveyance device configured to load each of the objects to be treated into the heating chambers, unload the object to be treated from the heating chambers, and convey the object to be treated under an oxygen-free atmosphere, wherein the conveyance device includes a cooling device configured to perform cooling treatment on the object to be treated.

A heat treatment system includes heating chambers configured to perform heat treatment on objects to be treated, and a conveyance device configured to load each of the objects to be treated into the heating chambers, unload the object to be treated from the heating chambers, and convey the object to be treated under an oxygen-free atmosphere, wherein the conveyance device includes a cooling device configured to perform cooling treatment on the object to be treated.