Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.

Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.