A method of producing cement clinker and a second calcined material, wherein the cement clinker is produced in a first production line and the second calcined material is produced from a raw material in a second production line by carrying out the following procedures e) optionally drying the raw material in a dryer, g) calcining the optionally dried raw material in a rotary kiln to obtain the second calcined material, wherein the sensible heat of a hot gas in the first production line is used as a heat source in the calcining step g) for calcining the raw material, and wherein the rotary kiln exhaust gas coming from the calcining step g) is introduced into the first production line for the secondary combustion of the rotary kiln exhaust gas.

A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.

A cooling roll including an axle and a sleeve, the sleeve having a length and a diameter and being structured as follows: an inner cylinder, a plurality of magnets disposed along at least a portion of the inner cylinder length, each magnet being defined by a width, a height and a length, a cooling system surrounding at least a portion of the plurality of magnets, the cooling system and the plurality of magnets being separated by a gap defined by a height, the gap height being the smallest distance between a magnet and the cooling system above, the magnets having a width such that the following formula is satisfied:
gap height×1.1≤magnet width≤gap height×8.6.

The present invention relates to a temperature-control unit for a furnace device for heat treating a plate, in particular a metal plate. The temperature-control unit has a temperature-control body, which is arrangeable in a furnace chamber of the furnace device. The temperature-control body has a plurality of receiving bores. Furthermore, the temperature-control unit has a plurality of temperature-control pins, wherein the temperature-control pins are mounted in the receiving bores movably relative to the temperature-control body. The temperature-control pins are controllable in such a way that a temperature-control group of the temperature-control pins is extendable from the temperature-control body in the direction towards the plate, so that a thermal contact between the temperature-control group of the temperature-control pins and a predetermined temperature-control zone of the plate is generatable.

A vacuum pressure furnace and/or a cooling plate for a vacuum pressure furnace is described, having a cooling channel or tube that selectively circulates a liquid coolant at a reduced temperature. The cooling channel “snakes” back and forth through a target plate assembly to conduct heat from the target plate assembly and back to the coolant. The target plate assembly includes a plurality of clamp members that are screwed over portions of the cooling channel and to a bottom of a plate member of the assembly, enclosing portions of the cooling channel. Thermal sheets or foil are wrapped around the cooling channel, thereby bridging any gaps between the components that may occur during temperature changes due to thermal expansion/contraction.

Cooling device (1) for cooling a wire (100), comprising a first chamber (2) and a second cooling chamber (4) through which the wire (100) passes. The device also comprises cooling liquid driving means (16) for driving the cooling liquid from the first chamber (2) to the second chamber (4) through at least one coding liquid inlet (12). Through the driving means (16) and the cooling liquid inlet (12), a jet of coding liquid is projected on the wire path at a mean speed of at least 0.6 m/s, and at a distance between 6 and 13 times the diameter of the wire (100). Cooling is performed in an inert gas atmosphere inside the second chamber (4). The invention also relates to a corresponding installation and a corresponding wire cooling method.

High temperature furnaces, calcining, pyrolysis and other high temperature manufacturing processes, composition rearrangements, and equipment. Systems, equipment and processes using oxyfuel combustion using gaseous fuels for cement manufacture. Reactor furnaces using oxyfuel containing natural gas and gravity feed to process pellets forming a pellet bed into cement.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.

A heater and/or cooler chamber includes a heat storage block or chunk. In the block a multitude of parallel, stacked slit pockets are each dimensioned to accommodate a single plate shaped workpiece. Workpiece handling openings of the slit pockets are freed and respectively covered by a door arrangement. The slit pockets are tailored to snugly surround the plate shaped workpieces therein so as to establish an efficient heat transfer between the heat storage block or chunk and the workpieces to be cooled or heated.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.