A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.

Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

A device, and method of operating the device, are disclosed. The device includes: a heat spreader having a first side and a second side opposite the first side, the heat spreader including at least one oscillating heat pipe arranged between the first side and the second side, at least one of the at least one oscillating heat pipe including a plurality of interconnected channels including a working fluid; at least one optoelectronic component coupled to the first side of the heat spreader; and at least one thermoelectric cooler, wherein a cold side of the at least one thermoelectric cooler is coupled to the second side of the heat spreader. The heat spreader may include one or more heat exchange features.

A rotating heat pipe is used for temperature control of electric motors and generators and other rotating heat generating assemblies to ensure their proper operation. The heat pipe is integral with the shaft, and unlike conventional devices, incorporates a solid-liquid phase change material as the heat transfer/transport material. In addition, it comprises a scraped surface heat exchange mechanism at the heat dissipation region to allow for high cooling rates as required. This scraped surface mechanism is preferentially driven by a magnetic coupling to eliminate issues related to leaks of the heat transfer material.

An enclosure for an optoelectronic sensor. The enclosure includes a thermodynamically open first chamber; a thermodynamically closed second chamber; and a rotor extending from the first chamber into the second chamber. The rotor includes a shaft part in the second chamber coaxial to the rotational axis of the rotor. The shaft part mounts an optoelectronic sensor device. The rotor includes a head part in the first chamber coaxial to the rotational axis of the rotor. A heat dissipation fan is fixedly arranged on and surrounds the head part. The head part and the fan are rotatably and thermally coupled to the shaft part to rotate simultaneously with the shaft part. The rotor transfers heat over the shaft part from the second chamber to the head part and the fan dissipates the transferred heat to an environment.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

According to the present specification there is provided a rotatable heat sink device which comprises a heat sink configured to enclose a cooling fluid, and the heat sink is rotatable about a rotational axis. The heat sink, in turn, comprises a first portion configured to receive thermal energy from a source external to the heat sink, and a second portion configured to dissipate at least a portion of the thermal energy to surroundings external to the device. The device further comprises an optical wavelength conversion material disposed on an outside surface of the first portion of the heat sink, and an agitator disposed inside the heat sink. The agitator is rotationally independent of the heat sink and is configured to promote circulation of the cooling fluid between the first portion and the second portion.

The present invention provides a vehicle (100) comprising: a body (4) having a skin; a heat source (12); and a thermal management system. The thermal management system comprises: a heat pipe (14) comprising: an evaporator end (close to 12) and a condenser end (close to heat exchanger 22a, 22b); a vapour arranged to flow from the evaporator end to the condenser end; and a working fluid arranged to flow from the condenser end to the evaporator end, wherein the heat pipe (14) is arranged such that the evaporator end is arranged in proximity to the heat source to absorb heat from the heat source; and one or more heat exchangers arranged in proximity to the condenser end and integrated with the skin. The present invention also provides a method of managing temperature in a vehicle.

A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.