A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

A multi-pipe three-dimensional pulsating heat pipe includes at least two pipes and at least two chambers. The at least two pipes form into respective three-dimensional annular loops. A cooling zone is formed to one side of the annular loops. Two opposing ends of the at least two pipes are connected spatially to the at least two chambers, respectively, so as to form the multi-pipe three dimensions pulsating heat pipe.

A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator fluidly coupled to a first condenser configured with a plurality of fins, with each of the plurality of fins having notches adjacent to flanges, the notches forming vapor flow channels through the plurality of fins. The first condenser is fluidly coupled to a second condenser, and vapor flowing from the evaporator must first pass through the first condenser before entering the second condenser.

The present invention provides a gravity high-efficiency heat dissipation apparatus comprising an evaporator and a condenser. The evaporator comprises a housing, an evaporation chamber arranged at the housing, and a skived structure arranged inside the evaporation chamber. The condenser comprises an upper circulating main pipe, a lower circulating main pipe and one or a plurality of condensation pipes having an upper opening and a lower opening fluidly connected to the upper circulating main pipe and the lower circulating main pipe respectively. The upper circulating main pipe is fluidly connected to an upper side of the evaporator via a first connecting pipe and is fluidly connected to an upper side of the evaporation chamber. The lower circulating main pipe is fluidly connected to one side of the evaporator via a second connecting pipe and is fluidly connected to the evaporation chamber. A circumferential side of each of the condensation pipes has one or a plurality of heat dissipation fins formed thereon.

A cooling device (100) is a device that cools a heat generator such as an electronic device (2) mounted in a mounting device such as an artificial satellite. The cooling device (100) includes a refrigerant flow path (10) configured annularly by sequentially connecting a pump (3) that circulates a liquid refrigerant, a cooler (4) that cools a heat generator such as an electronic device (2) with the refrigerant, and a heat exchanger (5) that cools the refrigerant. In addition, the cooling device (100) has a vapor mixing unit (20) that mixes the vapor generated by heat of at least one of heat intrusion from an outside to a mounting device such as an artificial satellite and heat generation of a heat generator such as the electronic device (2) into the refrigerant flowing into a cooler (4) in the refrigerant flow path (10).

An evaporator includes: a container; a first supplying unit configured to supply a liquid phase refrigerant to an inside of the container; a second supplying unit configured to supply the liquid phase refrigerant along a surface of the container; a heat absorbing unit configured to be disposed on the inside, and in which the liquid phase refrigerant supplied to the inside by the first supplying unit absorbs heat supplied from an outside of the container; a storage part configured to be disposed on the inside, stores the liquid phase refrigerant absorbing the heat in the heat absorbing unit, and stores the liquid phase refrigerant obtained by cooling and condensing a gaseous phase refrigerant evaporated by heat absorption in the heat absorbing unit by using the liquid phase refrigerant supplied along the surface by the second supplying unit; and a discharging unit configured to discharge the liquid phase refrigerant stored.

Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.