A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.

In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.

If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.

An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.

A cooling pipe system, including an evaporation pipe slantly arranged, a water inlet pipe, and a water removal assembly. An output end of the water inlet pipe is connected to an input end of the evaporation pipe, the water inlet pipe is connected to a three-way valve for introducing low molecular weight gas into the evaporation pipe. The water removal assembly is located below the evaporation pipe and includes a water sealing cavity, the output end of the evaporation pipe is connected to the water sealing cavity by means of a recovery pipe, the water sealing cavity is connected to a first pipeline extending upwards and communicated with the input end of the evaporation pipe, a lower end of the first pipeline is connected to a molecular sieve for preventing water vapor from passing through, and the water removal assembly is configured for absorbing the water vapor.

Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.

This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

An immersion cooling system configured to store a coolant configured for cooling a heat source and including a liquid container, a tube and a gas regulating assembly. The liquid container is configured to store the coolant configured to cool the heat source. One end of the tube is connected to the liquid container. The gas regulating assembly is located above the tube and includes a valve, a cooler, and a gas container. The valve includes a first pipe, a second pipe and a third pipe. The valve is switchable to connect the first pipe to the second pipe or connect the first pipe to the third pipe. The first pipe of the valve is connected to the tube via the cooler. The second pipe is connected to ambient air, and the third pipe is connected to the gas container.

Provided is an automatic secondary degassing fixed-length mechanism for an ultrathin heat pipe. The automatic secondary degassing fixed-length mechanism comprises an automatic lifting device A installed on a length adjustment sliding table, an automatic clamping device B, a length positioning and extension device C and a PLC. The present invention, having the advantages of simple structure, high efficiency and stability, is suitable for the secondary degassing fixed-length processing of heat pipes of different lengths, and particularly suitable for processing ultrathin heat pipes made of a thin-walled heat pipe by a flattening process, having advanced structural design and stable and high-efficiency production. In this mechanism, size positioning and automatic clamping in the secondary degassing fixed-length process for the heat pipes are correspondingly achieved through the automatic lifting device A and the automatic clamping device B. Downward component force applied to the thin-walled heat pipes in the die-opening-sealing process is released through the length positioning and extension device C, so that deformation of bending or partial sinking of pipe bodies of the thin-walled heat pipes in the secondary degassing fixed-length process is avoided. In this way, the qualification rate of the products and the economic benefit of the enterprise are greatly improved, and the problems with the existing secondary degassing fixed-length processing of the ultrathin heat pipe are solved.