A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

A cooling apparatus for a medium voltage switchgear includes an evaporator section; a fluid conduit; and a condenser section. The evaporator section surrounds a current carrying contact and is configured such that fluid within the evaporator section can contact an outer surface of the current carrying contact. The evaporator section is fluidly connected to the fluid conduit. At least part of the evaporator section is electrically insulating and is connected to the fluid conduit. The fluid conduit is fluidly connected to the condenser section. In use, a working fluid in the evaporator section is heated to a vapor state, the vapor is transferred by the fluid conduit to the condenser section, and the vapor in the condenser section is condensed to the working fluid. The working fluid is passively returned to the evaporator section.

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

A vapor source system based on vapor-liquid ejector supercharging combined with flash vaporization technology belongs to the technical fields of waste heat utilization and steam generation. The system comprises a vapor-liquid ejector, a flash vaporization tank and a intermediate heat exchanger, wherein the vapor-liquid ejector uses high-pressure steam to raise temperature and pressure of low-pressure water absorbed from the flash vaporization tank; the pressure-increased water is flashed into low-pressure saturated steam after entering the flash vaporization tank; the saturated water which is not flashed is collected at the bottom of the flash vaporization tank. The system generates multiple low-pressure flash vaporization saturated steam with a small portion of high-pressure steam, and realizes the recovery and utilization of waste heat such as flue gas of boiler, improves the economy of thermal process, and provides a flexible and adjustable vapor source for heavy oil thermal recovery, seawater desalination or sewage treatment equipment.

A passive hybrid heat transfer system for cooling a heat source, such as an integrated circuit, includes a thermosiphon heat transfer subsystem that operates in combination with a supplemental heat transfer subsystem to transfer heat away from and thereby cool the integrated circuit. The heat transfer system includes the thermosiphon heat transfer subsystem including a condenser coupled to an evaporator. The evaporator is coupled to the integrated circuit or other heat source and is positioned below the condenser relative to a direction of gravity. The supplemental heat transfer subsystem is thermally coupled to the evaporator of the thermosiphon heat transfer subsystem and has at least a portion extending below the evaporator relative to the direction of gravity. A network device like a switch or router may include the hybrid heat transfer system to cool high power integrated circuits without the need to resort to active cooling systems.

Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.

A heat transfer device includes a bag and a working fluid. The bag includes a first sheet and a second sheet with edges that are sealed together. The working fluid is enclosed in the bag. The working fluid changes a phase thereof between gas and liquid. The bag includes a vaporizing portion in which the liquid-phase working fluid is vaporized and a condensing portion in which the gas-phase working fluid is condensed. The bag includes a two-phase flow channel in which liquid-gas two-phase slug flow including the liquid-phase working fluid and the gas-phase working fluid occurs from the vaporizing portion to the condensing portion. The two-phase flow channel is provided in an internal space of the bag.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.

A vertical ground heat exchanger for reducing the temperature in the carbonaceous shale rock mass and preventing roadbed frost heave includes a heating mechanism, a heat releasing component respectively connected to both ends of the heating mechanism and a refrigeration heat exchange mechanism. The refrigeration heat exchange mechanism is connected to the lower end of the heating mechanism through a heat transfer pipeline and communicates with the heat releasing component. The heat releasing component includes a double-layer heat exchange tube component, a gas-liquid separator and a branch tube, wherein the double-layer heat exchange tube component is respectively connected to the both ends of the heating mechanism, the gas-liquid separator is connected to the double-layer heat exchange tube component, and the branch tube is connected between the gas-liquid separator and the refrigeration heat exchange mechanism. The double-layer heat exchange tube component includes an upper bellows and a lower bellows.