A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.

A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

A thermosiphon device includes an evaporator section, a condenser section and a liquid path configured to deliver liquid that exits the evaporator section directly back to the evaporator inlet. The condenser section has a significantly reduced mass flow rate and lower pressure drop as compared to the evaporator section, which has an increase liquid fraction of working fluid.

A cooling system includes an evaporator, connected through fluid lines to a first condenser, a second condenser, a compressor, and a thermal expansion valve. One or more valves are arranged in the fluid lines. The one or more valves operated to, in a first mode, circulate fluid between the evaporator the first condenser; in a second mode, circulate the fluid between a) the evaporator and the first condenser, and b) the evaporator, the second condenser, and the thermal expansion valve, and; in a third mode, circulate the fluid between a) the evaporator and the first condenser, and c) the evaporator, the compressor, the second condenser, and the thermal expansion valve.

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.

Refrigerative shelving arrangement comprising a heat-absorbing shelf (10) formed from a panel having first and second main faces containing plural passages (50) for conveying a working fluid in both liquid and gaseous states around an interior portion of the shelf (10); and a condenser (35) in fluid communication with the heat-absorbing shelf (10), wherein the heat-absorbing shelf (10) and the condenser (35) form a hermetically sealed system configured to allow the working fluid to circulate between the heat-absorbing shelf (10) and the condenser (35) without a compressor.

A multi-pipe three-dimensional pulsating heat pipe includes at least two pipes and at least two chambers. The at least two pipes form into respective three-dimensional annular loops. A cooling zone is formed to one side of the annular loops. Two opposing ends of the at least two pipes are connected spatially to the at least two chambers, respectively, so as to form the multi-pipe three dimensions pulsating heat pipe.

A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit and a working fluid. The heat exchanging unit is independently disposed and divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and a plurality of heat-dissipating fins for cooling the pipe. Two ends of the pipe are connected to from a closed pipe. The pipe runs in the first and the second heat exchanging portions alternately. The heat-dissipating fins are not continuously disposed in the first heat exchanging portion and the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The working fluid flows in the pipe.